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MPC8313ZQAGDB
Freescale Semiconductor
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Check for Price | No | Transferred | 32 | 400 MHz | 32 | 32 | 66.67 MHz | YES | 1 V | MICROPROCESSOR | CMOS | ALSO REQUIRES 3.3V I/O SUPPLY | YES | FLOATING POINT | YES | YES | 1.5 V | 950 mV | OTHER | S-PBGA-B516 | Not Qualified | e0 | 105 °C | 516 | PLASTIC/EPOXY | HBGA | BGA516,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | BGA | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516 | 516 | compliant | 3A991.A.2 | 8542.31.00.01 | ||
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MPC8313ZQAGDB
NXP Semiconductors
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Check for Price | No | Active | 32 | 400 MHz | 32 | 32 | 66.67 MHz | YES | 1 V | MICROPROCESSOR | CMOS | ALSO REQUIRES 3.3V I/O SUPPLY | YES | FLOATING POINT | YES | YES | 1.5 V | 950 mV | OTHER | S-PBGA-B516 | Not Qualified | e0 | 105 °C | 516 | PLASTIC/EPOXY | HBGA | BGA516,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516 | unknown | 3A991.A.2 | 8542.31.00.01 |