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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: MPC850DECVR66BU under Microprocessors

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Select Parts		Part Number

		MPC850DECVR66BU NXP Semiconductors
		MPC850DECVR66BU Freescale Semiconductor

				Most Relevant						Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Obsolete

32

66 MHz

32

26

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.6 V

3 V

INDUSTRIAL

S-PBGA-B256

Not Qualified

e1

3

95 °C

-40 °C

260

40

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

NXP SEMICONDUCTORS

BGA, BGA256,16X16,50

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Yes

Transferred

32

66 MHz

32

26

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.6 V

3 V

INDUSTRIAL

S-PBGA-B256

e1

3

95 °C

-40 °C

260

40

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA,

compliant

3A991.A.2

8542.31.00.01

NXP

Compare

MPC850DECVR66BU

NXP Semiconductors

Check for Price

Yes

Obsolete

32

66 MHz

32

26

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.6 V

3 V

INDUSTRIAL

S-PBGA-B256

Not Qualified

e1

3

95 °C

-40 °C

260

40

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

NXP SEMICONDUCTORS

BGA, BGA256,16X16,50

compliant

3A991.A.2

8542.31.00.01

NXP

Microcontrollers and Processors

MPC850DECVR66BU

Freescale Semiconductor

Check for Price

Yes

Yes

Transferred

32

66 MHz

32

26

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.6 V

3 V

INDUSTRIAL

S-PBGA-B256

e1

3

95 °C

-40 °C

260

40

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA,

compliant

3A991.A.2

8542.31.00.01

NXP