Findchips: Parametric Search Results for MPC8536EBVJATHA


Select Parts		Part Number

		MPC8536EBVJATHA NXP Semiconductors
		MPC8536EBVJATHA Freescale Semiconductor

				Most Relevant							Technical								Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

$237.4600

Yes

Obsolete

1.25 GHz

133 MHz

YES

1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.05 V

950 mV

S-PBGA-B783

Not Qualified

105 °C

260

783

PLASTIC/EPOXY

HBGA

BGA783,28X28,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.76 mm

29 mm

NXP SEMICONDUCTORS

29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783

compliant

5A002.A.1

8542.31.00.01

Check for Price

Yes

Transferred

1.25 GHz

133 MHz

YES

1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.05 V

950 mV

S-PBGA-B783

Not Qualified

783

PLASTIC/EPOXY

HBGA

BGA783,28X28,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1 mm

BOTTOM

2.76 mm

29 mm

FREESCALE SEMICONDUCTOR INC

29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783

compliant

Compare

MPC8536EBVJATHA

NXP Semiconductors

$237.4600

Yes

Obsolete

1.25 GHz

133 MHz

YES

1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.05 V

950 mV

S-PBGA-B783

Not Qualified

105 °C

260

783

PLASTIC/EPOXY

HBGA

BGA783,28X28,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.76 mm

29 mm

NXP SEMICONDUCTORS

29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783

compliant

5A002.A.1

8542.31.00.01

MPC8536EBVJATHA

Freescale Semiconductor

Check for Price

Yes

Transferred

1.25 GHz

133 MHz

YES

1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.05 V

950 mV

S-PBGA-B783

Not Qualified

783

PLASTIC/EPOXY

HBGA

BGA783,28X28,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1 mm

BOTTOM

2.76 mm

29 mm

FREESCALE SEMICONDUCTOR INC

29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783

compliant

Parametric results for: MPC8536EBVJATHA under Microprocessors