Findchips: Parametric Search Results for MPC8540PX833LC


Select Parts		Part Number

		MPC8540PX833LC Freescale Semiconductor
		MPC8540PX833LC Rochester Electronics LLC

				Most Relevant							Technical									Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

667 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR

CMOS

YES

FIXED POINT

YES

1.26 V

1.14 V

OTHER

S-PBGA-B783

Not Qualified

105 °C

260

783

PLASTIC/EPOXY

BGA

BGA783,28X28,40

SQUARE

GRID ARRAY

Tin/Lead/Silver (Sn/Pb/Ag)

BALL

1 mm

BOTTOM

3.85 mm

29 mm

FREESCALE SEMICONDUCTOR INC

BGA

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783

783

not_compliant

3A991.A.2

8542.31.00.01

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Active

667 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR

CMOS

YES

FIXED POINT

YES

1.26 V

1.14 V

OTHER

S-PBGA-B783

COMMERCIAL

105 °C

260

783

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1 mm

BOTTOM

3.85 mm

29 mm

ROCHESTER ELECTRONICS LLC

BGA

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783

783

unknown

Compare

MPC8540PX833LC

Freescale Semiconductor

Check for Price

Obsolete

667 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR

CMOS

YES

FIXED POINT

YES

1.26 V

1.14 V

OTHER

S-PBGA-B783

Not Qualified

105 °C

260

783

PLASTIC/EPOXY

BGA

BGA783,28X28,40

SQUARE

GRID ARRAY

Tin/Lead/Silver (Sn/Pb/Ag)

BALL

1 mm

BOTTOM

3.85 mm

29 mm

FREESCALE SEMICONDUCTOR INC

BGA

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783

783

not_compliant

3A991.A.2

8542.31.00.01

MPC8540PX833LC

Rochester Electronics LLC

Check for Price

Active

667 MHz

166 MHz

YES

1.2 V

MICROPROCESSOR

CMOS

YES

FIXED POINT

YES

1.26 V

1.14 V

OTHER

S-PBGA-B783

COMMERCIAL

105 °C

260

783

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1 mm

BOTTOM

3.85 mm

29 mm

ROCHESTER ELECTRONICS LLC

BGA

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783

783

unknown

Parametric results for: MPC8540PX833LC under Microprocessors