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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: MPC860PCZQ50D4 under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		MPC860PCZQ50D4 NXP Semiconductors
		MPC860PCZQ50D4 Freescale Semiconductor
		MPC860PCZQ50D4 Rochester Electronics LLC

				Most Relevant							Technical								Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

No

Obsolete

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

e0

3

-40 °C

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

unknown

3A991.A.2

8542.31.00.01

NXP

Check for Price

No

No

Transferred

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

e0

3

-40 °C

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

not_compliant

3A991.A.2

8542.31.00.01

NXP

BGA

357

Check for Price

No

No

Obsolete

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

COMMERCIAL

e0

3

245

30

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

ROCHESTER ELECTRONICS LLC

25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

unknown

BGA

357

Compare

NXP Semiconductors

No

Obsolete

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

e0

3

-40 °C

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

unknown

3A991.A.2

8542.31.00.01

NXP

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

No

No

Transferred

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

e0

3

-40 °C

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

not_compliant

3A991.A.2

8542.31.00.01

NXP

BGA

357

Microcontrollers and Processors

Rochester Electronics LLC

Check for Price

No

No

Obsolete

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

COMMERCIAL

e0

3

245

30

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

ROCHESTER ELECTRONICS LLC

25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

unknown

BGA

357