Findchips: Parametric Search Results for MPC885CZP133


Select Parts		Part Number

		KMPC885CZP133 Freescale Semiconductor
		KMPC885CZP133 NXP Semiconductors
		MPC885CZP133 Rochester Electronics LLC
		MPC885CZP133 Freescale Semiconductor
		MPC885CZP133 NXP Semiconductors

				Most Relevant							Technical								Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

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Transferred

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

BGA, BGA357,19X19,50

357

not_compliant

5A002

8542.31.00.01

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Obsolete

133 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

BGA,

unknown

3A991.A.2

8542.31.00.01

Check for Price

Yes

Active

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

COMMERCIAL

245

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

ROCHESTER ELECTRONICS LLC

BGA

PLASTIC, BGA-357

357

unknown

Check for Price

Transferred

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-357

357

not_compliant

5A002

8542.31.00.01

NXP

Check for Price

Obsolete

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-357

unknown

5A002.A.1

8542.31.00.01

NXP

Compare

KMPC885CZP133

Freescale Semiconductor

Check for Price

Transferred

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

BGA, BGA357,19X19,50

357

not_compliant

5A002

8542.31.00.01

KMPC885CZP133

NXP Semiconductors

Check for Price

Obsolete

133 MHz

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

BGA,

unknown

3A991.A.2

8542.31.00.01

MPC885CZP133

Rochester Electronics LLC

Check for Price

Yes

Active

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

COMMERCIAL

245

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

ROCHESTER ELECTRONICS LLC

BGA

PLASTIC, BGA-357

357

unknown

MPC885CZP133

Freescale Semiconductor

Check for Price

Transferred

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-357

357

not_compliant

5A002

8542.31.00.01

NXP

MPC885CZP133

NXP Semiconductors

Check for Price

Obsolete

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-357

unknown

5A002.A.1

8542.31.00.01

NXP

Parametric results for: MPC885CZP133 under Microprocessors