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Parametric results for: MSC815211 under Microprocessors

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Manufacturer Part Number: msc8152
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MSC8152TAG1000B
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 1 GHz 64 16 YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 970 mV S-PBGA-B783 e1 3 245 30 783 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.94 mm 29 mm 29 mm FREESCALE SEMICONDUCTOR INC 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783 compliant 3A991.A.1 8542.31.00.01
MSC8152TAG1000B
 NXP Semiconductors 		Check for Price Yes Obsolete 32 1 GHz 8192 64 16 YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 970 mV S-PBGA-B783 Not Qualified e1 3 245 30 783 PLASTIC/EPOXY HBGA BGA783,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.94 mm 29 mm 29 mm NXP SEMICONDUCTORS 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783 compliant 3A991.A.1 8542.31.00.01
MSC8152TVT1000B
 Freescale Semiconductor 		Check for Price Yes Obsolete 32 1 GHz 8192 64 16 YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 970 mV INDUSTRIAL S-PBGA-B783 Not Qualified 3 105 °C -40 °C 245 30 783 PLASTIC/EPOXY HBGA BGA783,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER OVER NICKEL BALL 1 mm BOTTOM 3.94 mm 29 mm 29 mm FREESCALE SEMICONDUCTOR INC 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783 not_compliant 5A992 8542.31.00.01 BGA 783
MSC8152SVT1000B
 Freescale Semiconductor 		Check for Price Yes Obsolete 32 1 GHz 8192 64 16 YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 970 mV OTHER S-PBGA-B783 Not Qualified 3 105 °C 245 30 783 PLASTIC/EPOXY HBGA BGA783,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER OVER NICKEL BALL 1 mm BOTTOM 3.94 mm 29 mm 29 mm FREESCALE SEMICONDUCTOR INC 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783 not_compliant 5A992 8542.31.00.01 BGA 783
MSC8152SAG1000B
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 1 GHz 64 16 YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 970 mV S-PBGA-B783 e1 3 245 30 783 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.94 mm 29 mm 29 mm FREESCALE SEMICONDUCTOR INC 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783 compliant 3A991.A.1 8542.31.00.01
MSC8152SAG1000B
 NXP Semiconductors 		Check for Price Yes Obsolete 32 1 GHz 8192 64 16 YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 970 mV S-PBGA-B783 Not Qualified e1 3 245 30 783 PLASTIC/EPOXY HBGA BGA783,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.94 mm 29 mm 29 mm NXP SEMICONDUCTORS HBGA, BGA783,28X28,40 compliant 3A991.A.1 8542.31.00.01