Parametric results for: MT8870DNR1 under Telecom Signaling Circuits
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MT8870DNR1
Microchip Technology Inc
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Check for Price | Yes | Active | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | MICROCHIP TECHNOLOGY INC | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | compliant | Microchip | ||||||||
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MT8870DNR1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G20 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | ZARLINK SEMICONDUCTOR INC | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | compliant | 8542.39.00.01 | ||||||
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MT8870DNR1
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | MICROSEMI CORP | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | compliant | Microsemi Corporation | 8542.39.00.01 | SSOP | 20 |