Parametric results for: MT8889CE1 under Telecom Signaling Circuits
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MT8889CE1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 10 µA | INDUSTRIAL | R-PDIP-T20 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 20 | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 25.905 mm | 5.33 mm | ZARLINK SEMICONDUCTOR INC | LEAD FREE, PLASTIC, MS-001AD, DIP-20 | compliant | 8542.39.00.01 | ||||||
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MT8889CE-1
Microsemi Corporation
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Check for Price | Yes | No | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 11 mA | INDUSTRIAL | R-PDIP-T20 | e0 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MITEL SEMICONDUCTOR | DIP, DIP20,.3 | unknown | 8542.39.00.01 | DIP | 20 | |||||||
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MT8889CE1
Microsemi Corporation
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Check for Price | Yes | Yes | Obsolete | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 11 mA | INDUSTRIAL | R-PDIP-T20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 25.905 mm | 5.33 mm | MICROSEMI CORP | LEAD FREE, PLASTIC, MS-001AD, DIP-20 | compliant | 8542.39.00.01 | DIP | 20 | Microsemi Corporation |