Parametric results for: MVTX2601AG1 under Network Interfaces
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MVTX2601AG2
Conexant Systems Inc
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Check for Price | Obsolete | 2.5 V | LAN SWITCHING CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B553 | e1 | Not Qualified | 85 °C | -40 °C | 553 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 37.5 mm | 37.5 mm | 2.46 mm | CONEXANT SYSTEMS | BGA | HBGA, | 553 | compliant | 8542.39.00.01 | ||||||
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MVTX2601AG
Zarlink Semiconductor Inc
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Check for Price | No | Transferred | 2.5 V | CMOS | LAN SWITCHING CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B553 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 553 | PLASTIC/EPOXY | HBGA | BGA553(UNSPEC) | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 37.5 mm | 37.5 mm | 2.46 mm | ZARLINK SEMICONDUCTOR INC | HBGA, BGA553(UNSPEC) | unknown | 8542.39.00.01 | ||||
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MVTX2601AG2
Zarlink Semiconductor Inc
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Check for Price | Transferred | 2.5 V | LAN SWITCHING CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B553 | e1 | Not Qualified | 85 °C | -40 °C | 553 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 37.5 mm | 37.5 mm | 2.46 mm | ZARLINK SEMICONDUCTOR INC | HBGA, | unknown | 8542.39.00.01 | ||||||||
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MVTX2601AG2
Microsemi Corporation
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Check for Price | Transferred | 2.5 V | LAN SWITCHING CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B553 | e1 | Not Qualified | 85 °C | -40 °C | 553 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 37.5 mm | 37.5 mm | 2.46 mm | ZARLINK SEMICONDUCTOR INC | BGA | HBGA, | 553 | unknown | 8542.39.00.01 | ||||||
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MVTX2601AG
Conexant Systems Inc
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Check for Price | No | Obsolete | CMOS | INDUSTRIAL | Not Qualified | 85 °C | -40 °C | 553 | PLASTIC/EPOXY | BGA | BGA553(UNSPEC) | GRID ARRAY | YES | BALL | BOTTOM | CONEXANT SYSTEMS | BGA, BGA553(UNSPEC) | compliant | 8542.39.00.01 | ||||||||||||||||
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MVTX2601AG
Microsemi Corporation
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Check for Price | No | Transferred | 2.5 V | CMOS | LAN SWITCHING CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B553 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 553 | PLASTIC/EPOXY | HBGA | BGA553(UNSPEC) | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 37.5 mm | 37.5 mm | 2.46 mm | ZARLINK SEMICONDUCTOR INC | BGA | HBGA, BGA553(UNSPEC) | 553 | unknown | 8542.39.00.01 |