Findchips: Parametric Search Results for MVTX2602A


Select Parts		Part Number

		MVTX2602AG2 Zarlink Semiconductor Inc
		MVTX2602AG2 Conexant Systems Inc
		MVTX2602AG Conexant Systems Inc
		MVTX2602AG Zarlink Semiconductor Inc
		MVTX2602AG2 Microsemi Corporation
		MVTX2602AG Microsemi Corporation

				Most Relevant		Technical			Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Transferred

2.5 V

CMOS

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

553

PLASTIC/EPOXY

HBGA

BGA553,29X29,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA553,29X29,50

compliant

8542.39.00.01

Check for Price

Obsolete

2.5 V

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

553

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

CONEXANT SYSTEMS

HBGA,

compliant

8542.39.00.01

BGA

553

Check for Price

Obsolete

CMOS

INDUSTRIAL

Not Qualified

85 °C

-40 °C

553

PLASTIC/EPOXY

BGA

BGA553(UNSPEC)

GRID ARRAY

YES

BALL

BOTTOM

CONEXANT SYSTEMS

BGA, BGA553(UNSPEC)

compliant

8542.39.00.01

Check for Price

Transferred

2.5 V

CMOS

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

225

553

PLASTIC/EPOXY

HBGA

BGA553(UNSPEC)

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA553(UNSPEC)

compliant

8542.39.00.01

Check for Price

Yes

Transferred

2.5 V

CMOS

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

553

PLASTIC/EPOXY

HBGA

BGA553,29X29,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA553,29X29,50

compliant

8542.39.00.01

BGA

553

Check for Price

Transferred

2.5 V

CMOS

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

225

553

PLASTIC/EPOXY

HBGA

BGA553(UNSPEC)

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA553(UNSPEC)

compliant

8542.39.00.01

BGA

553

Compare

MVTX2602AG2

Zarlink Semiconductor Inc

Check for Price

Yes

Transferred

2.5 V

CMOS

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

553

PLASTIC/EPOXY

HBGA

BGA553,29X29,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA553,29X29,50

compliant

8542.39.00.01

MVTX2602AG2

Conexant Systems Inc

Check for Price

Obsolete

2.5 V

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

553

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

CONEXANT SYSTEMS

HBGA,

compliant

8542.39.00.01

BGA

553

MVTX2602AG

Conexant Systems Inc

Check for Price

Obsolete

CMOS

INDUSTRIAL

Not Qualified

85 °C

-40 °C

553

PLASTIC/EPOXY

BGA

BGA553(UNSPEC)

GRID ARRAY

YES

BALL

BOTTOM

CONEXANT SYSTEMS

BGA, BGA553(UNSPEC)

compliant

8542.39.00.01

MVTX2602AG

Zarlink Semiconductor Inc

Check for Price

Transferred

2.5 V

CMOS

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

225

553

PLASTIC/EPOXY

HBGA

BGA553(UNSPEC)

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA553(UNSPEC)

compliant

8542.39.00.01

MVTX2602AG2

Microsemi Corporation

Check for Price

Yes

Transferred

2.5 V

CMOS

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

553

PLASTIC/EPOXY

HBGA

BGA553,29X29,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA553,29X29,50

compliant

8542.39.00.01

BGA

553

MVTX2602AG

Microsemi Corporation

Check for Price

Transferred

2.5 V

CMOS

LAN SWITCHING CIRCUIT

INDUSTRIAL

S-PBGA-B553

Not Qualified

85 °C

-40 °C

225

553

PLASTIC/EPOXY

HBGA

BGA553(UNSPEC)

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

37.5 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA553(UNSPEC)

compliant

8542.39.00.01

BGA

553

Parametric results for: MVTX2602A under Network Interfaces