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PEX8619-BA50BCG
PLX Technology
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Check for Price | Yes | Yes | Transferred | YES | BUS CONTROLLER, PCI | CMOS | S-PBGA-B324 | Not Qualified | NOT SPECIFIED | NOT SPECIFIED | 324 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | BALL | BOTTOM | PLX TECHNOLOGY INC | BGA | BGA, | 324 | unknown | 8542.31.00.01 | |||||||||||||||||
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PEX8619-BA50BCG
Avago Technologies
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Check for Price | Active | I2C; PCI; SMBUS; SPI; USB | YES | 1 V | BUS CONTROLLER, PCI | CMOS | IEEE 1149.1; IEEE 1149.6 | 1.05 V | 950 mV | COMMERCIAL | S-PBGA-B324 | Not Qualified | e1 | 3 | 70 °C | 260 | 324 | PLASTIC/EPOXY | HBGA | BGA324,18X18,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.9 mm | 19 mm | 19 mm | AVAGO TECHNOLOGIES INC | HBGA, BGA324,18X18,40 | compliant | 8542.31.00.01 | |||||||
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PEX8619-BA50BCG
Broadcom Limited
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Check for Price | Yes | Active | I2C; PCI; SMBUS; SPI; USB | YES | 1 V | BUS CONTROLLER, PCI | CMOS | IEEE 1149.1; IEEE 1149.6 | 1.05 V | 950 mV | COMMERCIAL | S-PBGA-B324 | Not Qualified | e1 | 3 | 70 °C | 260 | 324 | PLASTIC/EPOXY | HBGA | BGA324,18X18,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.9 mm | 19 mm | 19 mm | BROADCOM INC | HBGA, BGA324,18X18,40 | compliant | 8542.31.00.01 |