Parametric results for: S2076TB under Other Telecom ICs
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S2076TBC
Applied Micro Circuits Corporation
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Check for Price | No | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 910 mA | COMMERCIAL | S-PBGA-B208 | e0 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | LBGA | BGA208,17X17,50 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 1.65 mm | APPLIED MICRO CIRCUITS CORP | BGA | LBGA, BGA208,17X17,50 | 208 | unknown | 8542.39.00.01 | ||
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S2076TB
Applied Micro Circuits Corporation
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Check for Price | No | Transferred | 3.3 V | BIPOLAR | 910 mA | COMMERCIAL | S-PBGA-B208 | e0 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | BGA | BGA208,17X17,50 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | APPLIED MICRO CIRCUITS CORP | BGA, BGA208,17X17,50 | compliant | 8542.39.00.01 | |||||||||
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S2076TB
MACOM
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Check for Price | No | Contact Manufacturer | 3.3 V | BIPOLAR | 910 mA | COMMERCIAL | S-PBGA-B208 | e0 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | BGA | BGA208,17X17,50 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | M/A-COM TECHNOLOGY SOLUTIONS INC | BGA, BGA208,17X17,50 | compliant | 8542.39.00.01 |