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Parametric results for: SPC5123YVY400B under Microprocessors

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Manufacturer Part Number: spc5123yvy400b
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SPC5123YVY400B
 NXP Semiconductors 		$84.7350 Yes Active 32 400 MHz 32 32 35 MHz YES 1.4 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.47 V 1.33 V INDUSTRIAL S-PBGA-B516 Not Qualified e2 3 85 °C -40 °C 260 AEC-Q100 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 2.25 HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, TEBGA-516 compliant 3A991.A.2 8542.31.00.01 NXP
SPC5123YVY400BR
 Freescale Semiconductor 		Check for Price Yes Obsolete 32 400 MHz 32 32 35 MHz YES 1.4 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.47 V 1.33 V INDUSTRIAL S-PBGA-B516 Not Qualified e2 3 85 °C -40 °C 260 AEC-Q100 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC HBGA, BGA516,26X26,40 compliant 3A991 8542.31.00.01 BGA 516
SPC5123YVY400B
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 400 MHz 32 32 35 MHz YES 1.4 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.47 V 1.33 V INDUSTRIAL S-PBGA-B516 Not Qualified e2 3 85 °C -40 °C 260 AEC-Q100 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 2.25 HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, TEBGA-516 compliant 3A991.A.2 8542.31.00.01 NXP BGA 516