Findchips: Parametric Search Results for SY55855VKG-TR


Select Parts		Part Number

		SY55855VKG-TR Microchip Technology Inc
		SY55855VKGTR Micrel Inc
		SY55855VKGTR Microchip Technology Inc
		SY55855VKG-TR Micrel Inc

				Most Relevant		Technical											Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Number of Bits	Interface IC Type	Additional Feature	Delay-Max	Number of Functions	Output Latch or Register	Output Polarity	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$5.0885

Yes

Active

3.3 V

PECL TO LVDS TRANSLATOR

CML-TO-LVDS TRANSLATION ALSO POSSIBLE

700 ps

NONE

COMPLEMENTARY

80 mA

5.7 V

3 V

YES

INDUSTRIAL

S-PDSO-G10

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

500 µm

DUAL

3 mm

1.1 mm

3 mm

MICROCHIP TECHNOLOGY INC

LEAD FREE, MSOP-10

compliant

EAR99

8542.39.00.01

Microchip

Check for Price

Yes

Transferred

3.3 V

PECL TO LVDS TRANSLATOR

CML-TO-LVDS TRANSLATION ALSO POSSIBLE

700 ps

NONE

COMPLEMENTARY

5.7 V

3 V

YES

INDUSTRIAL

S-PDSO-G10

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

500 µm

DUAL

3 mm

1.1 mm

3 mm

MICREL INC

TSSOP,

compliant

EAR99

8542.39.00.01

MSOP

Check for Price

Yes

Transferred

3.3 V

PECL TO LVDS TRANSLATOR

CML-TO-LVDS TRANSLATION ALSO POSSIBLE

700 ps

NONE

COMPLEMENTARY

5.7 V

3 V

YES

INDUSTRIAL

S-PDSO-G10

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

500 µm

DUAL

3 mm

1.1 mm

3 mm

MICREL INC

TSSOP,

compliant

EAR99

8542.39.00.01

MSOP

Check for Price

Yes

Transferred

3.3 V

PECL TO LVDS TRANSLATOR

CML-TO-LVDS TRANSLATION ALSO POSSIBLE

700 ps

NONE

COMPLEMENTARY

5.7 V

3 V

YES

INDUSTRIAL

S-PDSO-G10

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

500 µm

DUAL

3 mm

1.1 mm

3 mm

MICREL INC

LEAD FREE, MSOP-10

compliant

Compare

SY55855VKG-TR

Microchip Technology Inc

$5.0885

Yes

Active

3.3 V

PECL TO LVDS TRANSLATOR

CML-TO-LVDS TRANSLATION ALSO POSSIBLE

700 ps

NONE

COMPLEMENTARY

80 mA

5.7 V

3 V

YES

INDUSTRIAL

S-PDSO-G10

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

500 µm

DUAL

3 mm

1.1 mm

3 mm

MICROCHIP TECHNOLOGY INC

LEAD FREE, MSOP-10

compliant

EAR99

8542.39.00.01

Microchip

SY55855VKGTR

Micrel Inc

Check for Price

Yes

Transferred

3.3 V

PECL TO LVDS TRANSLATOR

CML-TO-LVDS TRANSLATION ALSO POSSIBLE

700 ps

NONE

COMPLEMENTARY

5.7 V

3 V

YES

INDUSTRIAL

S-PDSO-G10

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

500 µm

DUAL

3 mm

1.1 mm

3 mm

MICREL INC

TSSOP,

compliant

EAR99

8542.39.00.01

MSOP

SY55855VKGTR

Microchip Technology Inc

Check for Price

Yes

Transferred

3.3 V

PECL TO LVDS TRANSLATOR

CML-TO-LVDS TRANSLATION ALSO POSSIBLE

700 ps

NONE

COMPLEMENTARY

5.7 V

3 V

YES

INDUSTRIAL

S-PDSO-G10

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

500 µm

DUAL

3 mm

1.1 mm

3 mm

MICREL INC

TSSOP,

compliant

EAR99

8542.39.00.01

MSOP

SY55855VKG-TR

Micrel Inc

Check for Price

Yes

Transferred

3.3 V

PECL TO LVDS TRANSLATOR

CML-TO-LVDS TRANSLATION ALSO POSSIBLE

700 ps

NONE

COMPLEMENTARY

5.7 V

3 V

YES

INDUSTRIAL

S-PDSO-G10

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

500 µm

DUAL

3 mm

1.1 mm

3 mm

MICREL INC

LEAD FREE, MSOP-10

compliant

Parametric results for: SY55855VKG-TR under Level Translators