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Parametric » Telecommunication Circuits » Other Telecom ICs

Parametric results for: TDA7541B under Other Telecom ICs

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Select Parts		Part Number

		TDA7541BWTR STMicroelectronics
		TDA7541B STMicroelectronics
		TDA7541BW STMicroelectronics
		TDA7541BTR STMicroelectronics

				Most Relevant			Technical		Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code	ECCN Code

Check for Price

Yes

Active

8.5 V

BICMOS

TELECOM CIRCUIT

1

INDUSTRIAL

S-PQFP-G64

e1

Not Qualified

3

85 °C

-40 °C

260

30

64

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

YES

TIN SILVER COPPER

GULL WING

QUAD

STMICROELECTRONICS

QFP

QFP,

64

compliant

8542.39.00.01

Check for Price

Yes

Active

8.5 V

BICMOS

TELECOM CIRCUIT

1

INDUSTRIAL

S-PQFP-G64

e4

Not Qualified

3

85 °C

-40 °C

260

30

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

NICKEL PALLADIUM GOLD

GULL WING

500 µm

QUAD

10 mm

10 mm

1.6 mm

STMICROELECTRONICS

QFP

LFQFP,

64

compliant

8542.39.00.01

EAR99

Check for Price

Yes

Active

8.5 V

BICMOS

TELECOM CIRCUIT

1

INDUSTRIAL

S-PQFP-G64

e1

Not Qualified

3

85 °C

-40 °C

260

30

64

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

YES

TIN SILVER COPPER

GULL WING

QUAD

STMICROELECTRONICS

QFP

QFP,

64

compliant

8542.39.00.01

Check for Price

Yes

Yes

Active

8.5 V

BICMOS

TELECOM CIRCUIT

1

INDUSTRIAL

S-PQFP-G64

e4

Not Qualified

3

85 °C

-40 °C

260

30

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

NICKEL PALLADIUM GOLD

GULL WING

500 µm

QUAD

10 mm

10 mm

1.6 mm

STMICROELECTRONICS

QFP

LFQFP,

64

compliant

8542.39.00.01

Compare

Telecommunication Circuits

STMicroelectronics

Check for Price

Yes

Active

8.5 V

BICMOS

TELECOM CIRCUIT

1

INDUSTRIAL

S-PQFP-G64

e1

Not Qualified

3

85 °C

-40 °C

260

30

64

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

YES

TIN SILVER COPPER

GULL WING

QUAD

STMICROELECTRONICS

QFP

QFP,

64

compliant

8542.39.00.01

Telecommunication Circuits

STMicroelectronics

Check for Price

Yes

Active

8.5 V

BICMOS

TELECOM CIRCUIT

1

INDUSTRIAL

S-PQFP-G64

e4

Not Qualified

3

85 °C

-40 °C

260

30

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

NICKEL PALLADIUM GOLD

GULL WING

500 µm

QUAD

10 mm

10 mm

1.6 mm

STMICROELECTRONICS

QFP

LFQFP,

64

compliant

8542.39.00.01

EAR99

Telecommunication Circuits

STMicroelectronics

Check for Price

Yes

Active

8.5 V

BICMOS

TELECOM CIRCUIT

1

INDUSTRIAL

S-PQFP-G64

e1

Not Qualified

3

85 °C

-40 °C

260

30

64

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

YES

TIN SILVER COPPER

GULL WING

QUAD

STMICROELECTRONICS

QFP

QFP,

64

compliant

8542.39.00.01

Telecommunication Circuits

STMicroelectronics

Check for Price

Yes

Yes

Active

8.5 V

BICMOS

TELECOM CIRCUIT

1

INDUSTRIAL

S-PQFP-G64

e4

Not Qualified

3

85 °C

-40 °C

260

30

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

NICKEL PALLADIUM GOLD

GULL WING

500 µm

QUAD

10 mm

10 mm

1.6 mm

STMICROELECTRONICS

QFP

LFQFP,

64

compliant

8542.39.00.01