Parametric results for: TK5551 under Other Telecom ICs
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TK5551M-PP
Atmel Corporation
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Check for Price | Yes | No | Obsolete | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PUUC-N | e0 | Not Qualified | 85 °C | -40 °C | PLASTIC/EPOXY | DIE | MODULE(UNSPEC) | RECTANGULAR | UNCASED CHIP | YES | TIN LEAD | NO LEAD | UPPER | ATMEL CORP | DIE | PLASTIC PACKAGE | unknown | 8542.39.00.01 | Microchip | ||
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TK5551A-PP
Atmel Corporation
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Check for Price | No | No | Obsolete | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PXMA-X | e0 | Not Qualified | 85 °C | -40 °C | PLASTIC/EPOXY | MODULE(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | TIN LEAD | UNSPECIFIED | UNSPECIFIED | ATMEL CORP | , MODULE(UNSPEC) | compliant | 8542.39.00.01 | |||||
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TK5551A-PP
Temic Semiconductors
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Check for Price | Transferred | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PXMA-X | Not Qualified | 85 °C | -40 °C | PLASTIC/EPOXY | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | TEMIC SEMICONDUCTORS | unknown |