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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: TSPC750AMGBT10LE under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		TSPC750AMGB/T10LE e2v technologies
		TSPC750AMGB/T10LE Thales Group
		TSPC750AMGB/T10LE Atmel Corporation

			Most Relevant							Technical									Compliance		Operating Conditions				Physical								Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

32

233 MHz

64

32

83.3 MHz

YES

2.6 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

2.7 V

2.5 V

MILITARY

S-CBGA-B360

Not Qualified

125 °C

-55 °C

MIL-STD-883

360

CERAMIC, METAL-SEALED COFIRED

SQUARE

GRID ARRAY

BALL

BOTTOM

ATMEL GRENOBLE

BGA

,

360

unknown

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

32

233 MHz

64

32

83.3 MHz

YES

2.6 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

2.7 V

2.5 V

MILITARY

S-CBGA-B360

Not Qualified

125 °C

-55 °C

MIL-STD-883

360

CERAMIC, METAL-SEALED COFIRED

SQUARE

GRID ARRAY

BALL

BOTTOM

THOMSON-CSF SEMICONDUCTORS

BGA

,

360

unknown

3A991.A.2

8542.31.00.01

Check for Price

No

Obsolete

32

233 MHz

64

32

83.3 MHz

YES

2.6 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

2.7 V

2.5 V

MILITARY

S-CBGA-B360

Not Qualified

1

125 °C

-55 °C

MIL-STD-883

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

25 mm

ATMEL CORP

BGA

BGA,

360

compliant

3A991.A.2

8542.31.00.01

Compare

Microcontrollers and Processors

TSPC750AMGB/T10LE

e2v technologies

Check for Price

Obsolete

32

233 MHz

64

32

83.3 MHz

YES

2.6 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

2.7 V

2.5 V

MILITARY

S-CBGA-B360

Not Qualified

125 °C

-55 °C

MIL-STD-883

360

CERAMIC, METAL-SEALED COFIRED

SQUARE

GRID ARRAY

BALL

BOTTOM

ATMEL GRENOBLE

BGA

,

360

unknown

3A991.A.2

8542.31.00.01

Microcontrollers and Processors

TSPC750AMGB/T10LE

Thales Group

Check for Price

Obsolete

32

233 MHz

64

32

83.3 MHz

YES

2.6 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

2.7 V

2.5 V

MILITARY

S-CBGA-B360

Not Qualified

125 °C

-55 °C

MIL-STD-883

360

CERAMIC, METAL-SEALED COFIRED

SQUARE

GRID ARRAY

BALL

BOTTOM

THOMSON-CSF SEMICONDUCTORS

BGA

,

360

unknown

3A991.A.2

8542.31.00.01

Microcontrollers and Processors

TSPC750AMGB/T10LE

Atmel Corporation

Check for Price

No

Obsolete

32

233 MHz

64

32

83.3 MHz

YES

2.6 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

2.7 V

2.5 V

MILITARY

S-CBGA-B360

Not Qualified

1

125 °C

-55 °C

MIL-STD-883

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

25 mm

ATMEL CORP

BGA

BGA,

360

compliant

3A991.A.2

8542.31.00.01