Parametric results for: V6108WP11E-DIE WAFLE PACK under Telecom Switching Circuits
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MUSA16P14-B456C
Music Semiconductors Inc
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Check for Price | No | Contact Manufacturer | 3.3 V | PACKET ROUTING SWITCH | 1 | COMMERCIAL | S-PBGA-B456 | e0 | Not Qualified | 3 | 70 °C | 456 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | BOTTOM | MUSIC SEMICONDUCTORS INC | BGA | , | 456 | unknown | 8542.39.00.01 | |||||||||||||
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IBM3209K4060
IBM
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Check for Price | No | No | Contact Manufacturer | 3.3 V | CMOS | PACKET ROUTING SWITCH | 1 | S-CBGA-X624 | e0 | Not Qualified | 624 | CERAMIC, METAL-SEALED COFIRED | CGA | BGA624,25X25,50 | SQUARE | GRID ARRAY | YES | TIN LEAD | UNSPECIFIED | 1.27 mm | BOTTOM | 32.305 mm | 32.305 mm | 7.51 mm | IBM MICROELECTRONICS | CGA | CGA, BGA624,25X25,50 | 624 | unknown | 8542.39.00.01 | ||||||||
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MT90882B/IG/BP1N
Zarlink Semiconductor Inc
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Check for Price | No | Obsolete | 1.8 V | PACKET ROUTING SWITCH | 1 | INDUSTRIAL | S-PBGA-B456 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 456 | PLASTIC/EPOXY | BGA | BGA456,26X26,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | ZARLINK SEMICONDUCTOR INC | BGA, BGA456,26X26,40 | compliant | 8542.39.00.01 | |||||||
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QM11033ASB
Qorvo
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Check for Price | Yes | Not Recommended | PACKET ROUTING SWITCH | e4 | 3 | 260 | GOLD OVER NICKEL | QORVO INC | unknown | 8542.39.00.01 | 2020-03-18 | |||||||||||||||||||||||||||
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IBM3221L0572
IBM
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Check for Price | No | Contact Manufacturer | 1.5 V | CMOS | PACKET ROUTING SWITCH | 1 | S-CBGA-X624 | e0 | Not Qualified | 624 | CERAMIC, METAL-SEALED COFIRED | CGA | BGA624,25X25,50 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | UNSPECIFIED | 1.27 mm | BOTTOM | 32.305 mm | 32.305 mm | 7.51 mm | IBM MICROELECTRONICS | CGA | CGA, BGA624,25X25,50 | 624 | unknown | 8542.39.00.01 | |||||||||
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MT90881A/IG/BP1N
Microsemi Corporation
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Check for Price | No | No | Obsolete | 1.8 V | PACKET ROUTING SWITCH | 1 | INDUSTRIAL | S-PBGA-B456 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 456 | PLASTIC/EPOXY | BGA | BGA456,26X26,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | ZARLINK SEMICONDUCTOR INC | BGA | BGA, BGA456,26X26,40 | 456 | compliant | 8542.39.00.01 | ||||
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IBM3229P2815
IBM
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Check for Price | Contact Manufacturer | 1.8 V | CMOS | PACKET ROUTING SWITCH | 1 | S-PBGA-B624 | Not Qualified | 624 | PLASTIC/EPOXY | BGA | BGA624,25X25,50 | SQUARE | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 33 mm | 33 mm | 3.1 mm | IBM MICROELECTRONICS | BGA | BGA, BGA624,25X25,50 | 624 | unknown | 8542.39.00.01 | ||||||||||||
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FM4212-F1433-CG
Intel Corporation
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Check for Price | Active | PACKET ROUTING SWITCH | INTEL CORP | unknown | ||||||||||||||||||||||||||||||||||
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IBM3288H2848
IBM
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Check for Price | Contact Manufacturer | 1.8 V | CMOS | PACKET ROUTING SWITCH | 1 | S-CBGA-X1088 | Not Qualified | 1088 | CERAMIC, METAL-SEALED COFIRED | CGA | SQUARE | GRID ARRAY | YES | UNSPECIFIED | 1.27 mm | BOTTOM | 42.5 mm | 42.5 mm | 7.33 mm | IBM MICROELECTRONICS | CGA | CGA, | 1088 | unknown | 8542.39.00.01 | |||||||||||||
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FM4224-F1433-CG
Intel Corporation
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Check for Price | Active | PACKET ROUTING SWITCH | INTEL CORP | unknown |