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Parametric results for: W83877TG under Microcontrollers

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Manufacturer Part Number: w83877tg

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Select Parts		Part Number

		W83877TG Nuvoton Technology Corp
		W83877TG Winbond Electronics Corp

			Most Relevant		Technical		Compliance		Operating Conditions	Physical									Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

Yes

Obsolete

YES

5 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

QFP

QFP100,.75X.99

RECTANGULAR

FLATPACK

GULL WING

635 µm

QUAD

NUVOTON TECHNOLOGY CORP

QFP

QFP, QFP100,.75X.99

100

compliant

8542.31.00.01

Check for Price

Yes

Transferred

YES

5 V

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

QFP

QFP100,.75X.99

RECTANGULAR

FLATPACK

GULL WING

635 µm

QUAD

WINBOND ELECTRONICS CORP

QFP, QFP100,.75X.99

unknown

8542.31.00.01

Compare

W83877TG

Nuvoton Technology Corp

Check for Price

Yes

Obsolete

YES

5 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

QFP

QFP100,.75X.99

RECTANGULAR

FLATPACK

GULL WING

635 µm

QUAD

NUVOTON TECHNOLOGY CORP

QFP

QFP, QFP100,.75X.99

100

compliant

8542.31.00.01

W83877TG

Winbond Electronics Corp

Check for Price

Yes

Transferred

YES

5 V

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

QFP

QFP100,.75X.99

RECTANGULAR

FLATPACK

GULL WING

635 µm

QUAD

WINBOND ELECTRONICS CORP

QFP, QFP100,.75X.99

unknown

8542.31.00.01