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XC2C64A-7CPG56I
AMD Xilinx
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Check for Price | Yes | Yes | Transferred | 1.8 V | 7.5 ns | 64 | 45 | FLASH PLD | INDUSTRIAL | SQUARE | CMOS | 0 DEDICATED INPUTS, 45 I/O | REAL DIGITAL DESIGN TECHNOLOGY | 200 MHz | YES | YES | MACROCELL | 1.9 V | 1.7 V | S-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | PLASTIC/EPOXY | LFBGA | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 6 mm | 6 mm | 1.35 mm | XILINX INC | BGA | 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56 | 56 | compliant | EAR99 | 8542.39.00.01 | |||
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XC2C64A-7CPG56I
AMD
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Check for Price | Yes | Obsolete | 1.8 V | 7.5 ns | 64 | 45 | FLASH PLD | INDUSTRIAL | SQUARE | CMOS | 0 DEDICATED INPUTS, 45 I/O | REAL DIGITAL DESIGN TECHNOLOGY | 200 MHz | YES | YES | MACROCELL | 1.9 V | 1.7 V | S-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | PLASTIC/EPOXY | LFBGA | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 6 mm | 6 mm | 1.35 mm | ADVANCED MICRO DEVICES INC | 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56 | compliant | AMD |