Parametric results for: ZL30121GGG2 under ATM/SONET/SDH ICs

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Manufacturer Part Number: zl30121ggg2
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ZL30121GGG2V2
Microsemi Corporation
$87.7531 Yes Transferred 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT 1 INDUSTRIAL S-PBGA-B100 e1 Not Qualified 85 °C -40 °C 100 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 800 µm BOTTOM 9 mm 9 mm 1.72 mm MICROSEMI CORP BGA LEAD FREE, 9 X 9 MM, 0.80 MM PITCH, CABGA-100 100 compliant 8542.39.00.01 Microsemi Corporation
ZL30121GGG2V2
Microchip Technology Inc
$167.6050 Yes Active 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT 1 INDUSTRIAL S-PBGA-B100 e1 Not Qualified 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY FBGA BGA100,10X10,32 SQUARE GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 9 mm 9 mm 1.72 mm MICROCHIP TECHNOLOGY INC compliant Microchip
ZL30121GGG2
Microsemi Corporation
Check for Price Obsolete 1.8 V ATM/SONET/SDH SUPPORT CIRCUIT 1 INDUSTRIAL S-PBGA-B100 e1 Not Qualified 85 °C -40 °C 100 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 9 mm 9 mm 1.72 mm ZARLINK SEMICONDUCTOR INC BGA FBGA, 100 unknown 8542.39.00.01
ZL30121GGG2V2
Zarlink Semiconductor Inc
Check for Price Transferred 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT SONET;SDH 1 INDUSTRIAL S-PBGA-B100 e1 Not Qualified 85 °C -40 °C 100 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 800 µm BOTTOM 9 mm 9 mm 1.72 mm ZARLINK SEMICONDUCTOR INC LEAD FREE, 9 X 9 MM, 0.80 MM PITCH, CABGA-100 unknown 8542.39.00.01
ZL30121GGG2
Zarlink Semiconductor Inc
Check for Price Obsolete 1.8 V ATM/SONET/SDH SUPPORT CIRCUIT 1 INDUSTRIAL S-PBGA-B100 e1 Not Qualified 85 °C -40 °C 100 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 9 mm 9 mm 1.72 mm ZARLINK SEMICONDUCTOR INC FBGA, unknown 8542.39.00.01