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Parametric » Telecommunication Circuits » Other Telecom ICs

Parametric results for: ZL38003GMG2 under Other Telecom ICs

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Select Parts		Part Number

		ZL38003GMG2 Microchip Technology Inc
		ZL38003GMG2 Microsemi Corporation
		ZL38003GMG2 Zarlink Semiconductor Inc

				Most Relevant	Technical		Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	Part Package Code	Pin Count	HTS Code	Samacsys Manufacturer

Yes

Obsolete

TELECOM CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

e1

Not Qualified

85 °C

-40 °C

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

10 mm

10 mm

1.52 mm

MICROCHIP TECHNOLOGY INC

10 X 10 MM, 1 MM PITCH, LEAD FREE, CBGA-81

compliant

Check for Price

Yes

Yes

Transferred

TELECOM CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

e1

Not Qualified

85 °C

-40 °C

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

10 mm

10 mm

1.52 mm

MICROSEMI CORP

10 X 10 MM, 1 MM PITCH, LEAD FREE, CBGA-81

compliant

BGA

81

8542.39.00.01

Microsemi Corporation

Check for Price

Yes

Transferred

TELECOM CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

e1

Not Qualified

85 °C

-40 °C

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

10 mm

10 mm

1.52 mm

ZARLINK SEMICONDUCTOR INC

10 X 10 MM, 1 MM PITCH, LEAD FREE, CBGA-81

compliant

8542.39.00.01

Compare

Microchip Technology Inc

Yes

Obsolete

TELECOM CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

e1

Not Qualified

85 °C

-40 °C

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

10 mm

10 mm

1.52 mm

MICROCHIP TECHNOLOGY INC

10 X 10 MM, 1 MM PITCH, LEAD FREE, CBGA-81

compliant

Telecommunication Circuits

Microsemi Corporation

Check for Price

Yes

Yes

Transferred

TELECOM CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

e1

Not Qualified

85 °C

-40 °C

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

10 mm

10 mm

1.52 mm

MICROSEMI CORP

10 X 10 MM, 1 MM PITCH, LEAD FREE, CBGA-81

compliant

BGA

81

8542.39.00.01

Microsemi Corporation

Zarlink Semiconductor Inc

Check for Price

Yes

Transferred

TELECOM CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

e1

Not Qualified

85 °C

-40 °C

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

10 mm

10 mm

1.52 mm

ZARLINK SEMICONDUCTOR INC

10 X 10 MM, 1 MM PITCH, LEAD FREE, CBGA-81

compliant

8542.39.00.01