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Parametric » Telecommunication Circuits » Telecom Switching Circuits

Parametric results for: ZL50023GAC under Telecom Switching Circuits

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Select Parts		Part Number

		ZL50023GAC Microsemi Corporation
		ZL50023GAC Microchip Technology Inc
		ZL50023GAC Zarlink Semiconductor Inc

				Most Relevant		Technical				Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

No

No

Obsolete

1.8 V

CMOS

DIGITAL TIME SWITCH

1

INDUSTRIAL

S-PBGA-B256

e0

Not Qualified

85 °C

-40 °C

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

400 µm

BOTTOM

17 mm

17 mm

1.6 mm

MICROSEMI CORP

BGA

17 X 17 MM, 1.61 MM HEIGHT, PLASTIC, MS-034, BGA-256

256

unknown

8542.39.00.01

Check for Price

Active

1.8 V

CONFERENCING CIRCUIT

1

130 mA

INDUSTRIAL

S-PBGA-B256

85 °C

-40 °C

256

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

DUAL

17 mm

17 mm

1.8 mm

MICROCHIP TECHNOLOGY INC

compliant

8542.39.00.01

Check for Price

No

Transferred

1.8 V

CMOS

DIGITAL TIME SWITCH

1

INDUSTRIAL

S-PBGA-B256

e0

Not Qualified

1

85 °C

-40 °C

225

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

400 µm

BOTTOM

17 mm

17 mm

1.6 mm

ZARLINK SEMICONDUCTOR INC

LFBGA, BGA256,16X16,40

compliant

8542.39.00.01

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Telecommunication Circuits

Microsemi Corporation

Check for Price

No

No

Obsolete

1.8 V

CMOS

DIGITAL TIME SWITCH

1

INDUSTRIAL

S-PBGA-B256

e0

Not Qualified

85 °C

-40 °C

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

400 µm

BOTTOM

17 mm

17 mm

1.6 mm

MICROSEMI CORP

BGA

17 X 17 MM, 1.61 MM HEIGHT, PLASTIC, MS-034, BGA-256

256

unknown

8542.39.00.01

Microchip Technology Inc

Check for Price

Active

1.8 V

CONFERENCING CIRCUIT

1

130 mA

INDUSTRIAL

S-PBGA-B256

85 °C

-40 °C

256

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

DUAL

17 mm

17 mm

1.8 mm

MICROCHIP TECHNOLOGY INC

compliant

8542.39.00.01

Zarlink Semiconductor Inc

Check for Price

No

Transferred

1.8 V

CMOS

DIGITAL TIME SWITCH

1

INDUSTRIAL

S-PBGA-B256

e0

Not Qualified

1

85 °C

-40 °C

225

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

400 µm

BOTTOM

17 mm

17 mm

1.6 mm

ZARLINK SEMICONDUCTOR INC

LFBGA, BGA256,16X16,40

compliant

8542.39.00.01