Findchips: Parametric Search Results for ZL50110GAG2


Select Parts		Part Number

		ZL50110GAG2 Microsemi Corporation
		ZL50110GAG2 Zarlink Semiconductor Inc
		ZL50110GAG2 AMD Xilinx
		ZL50110GAG2 Microchip Technology Inc

				Most Relevant			Technical		Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Data Rate	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code	Samacsys Manufacturer

$147.9100

Yes

Transferred

1.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B552

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

552

PLASTIC/EPOXY

BGA

BGA552,26X26,50

SQUARE

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

35 mm

2.53 mm

MICROSEMI CORP

BGA

35 X 35 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAR-2, BGA-552

552

compliant

8542.39.00.01

Microsemi Corporation

Check for Price

Yes

Transferred

1.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B552

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

552

PLASTIC/EPOXY

BGA

BGA552,26X26,50

SQUARE

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

35 mm

2.53 mm

ZARLINK SEMICONDUCTOR INC

35 X 35 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAR-2, BGA-552

compliant

8542.39.00.01

Check for Price

Yes

Active

TELECOM CIRCUIT

S-PBGA-B552

Not Qualified

NOT SPECIFIED

552

PLASTIC/EPOXY

SQUARE

GRID ARRAY

YES

TIN SILVER OVER COPPER

BALL

BOTTOM

XILINX INC

BGA

552

compliant

Check for Price

Yes

Active

1.8 V

100 Gbps

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B552

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

552

PLASTIC/EPOXY

BGA

BGA552,26X26,50

SQUARE

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

35 mm

2.53 mm

MICROCHIP TECHNOLOGY INC

35 X 35 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAR-2, BGA-552

compliant

Compare

ZL50110GAG2

Microsemi Corporation

$147.9100

Yes

Transferred

1.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B552

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

552

PLASTIC/EPOXY

BGA

BGA552,26X26,50

SQUARE

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

35 mm

2.53 mm

MICROSEMI CORP

BGA

35 X 35 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAR-2, BGA-552

552

compliant

8542.39.00.01

Microsemi Corporation

ZL50110GAG2

Zarlink Semiconductor Inc

Check for Price

Yes

Transferred

1.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B552

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

552

PLASTIC/EPOXY

BGA

BGA552,26X26,50

SQUARE

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

35 mm

2.53 mm

ZARLINK SEMICONDUCTOR INC

35 X 35 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAR-2, BGA-552

compliant

8542.39.00.01

ZL50110GAG2

AMD Xilinx

Check for Price

Yes

Active

TELECOM CIRCUIT

S-PBGA-B552

Not Qualified

NOT SPECIFIED

552

PLASTIC/EPOXY

SQUARE

GRID ARRAY

YES

TIN SILVER OVER COPPER

BALL

BOTTOM

XILINX INC

BGA

552

compliant

ZL50110GAG2

Microchip Technology Inc

Check for Price

Yes

Active

1.8 V

100 Gbps

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B552

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

552

PLASTIC/EPOXY

BGA

BGA552,26X26,50

SQUARE

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

35 mm

2.53 mm

MICROCHIP TECHNOLOGY INC

35 X 35 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAR-2, BGA-552

compliant

Parametric results for: ZL50110GAG2 under Other Telecom ICs