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ZL50235QCG1
Microsemi Corporation
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$74.8726 | Yes | Yes | Transferred | 1.8 V | CMOS | ISDN ECHO CANCELLER | 1 | INDUSTRIAL | S-PQFP-G100 | e3 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MICROSEMI CORP | QFP | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BED, LQFP-100 | 100 | compliant | 8542.39.00.01 | Microsemi Corporation | |||||
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ZL50235QCG1
Microchip Technology Inc
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$96.8179 | Yes | Active | 1.8 V | CMOS | ISDN ECHO CANCELLER | 1 | INDUSTRIAL | S-PQFP-G100 | e3 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MICROCHIP TECHNOLOGY INC | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BED, LQFP-100 | compliant | Microchip | |||||||||
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ZL50235QCG1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 1.8 V | ISDN ECHO CANCELLER | 1 | INDUSTRIAL | S-PQFP-G100 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | ZARLINK SEMICONDUCTOR INC | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BED, LQFP-100 | compliant | 8542.39.00.01 |