Findchips.com

Register or Sign In

Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: am1806ezce4 under Microprocessors

Select parts from the table below to compare.

Compare


	Part Number

Microcontrollers and Processors

Texas Instruments

				Most Relevant								Technical											Compliance		Operating Conditions				Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	RAM (words)	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Number of DMA Channels	On Chip Data RAM Width	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Yes

Yes

Active

32

456 MHz

172032

16

23

30 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

80

8

1.35 V

1.25 V

OTHER

S-PBGA-B361

e1

3

90 °C

260

30

361

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

650 µm

BOTTOM

1.3 mm

13 mm

13 mm

TEXAS INSTRUMENTS INC

LFBGA,

compliant

3A991.A.2

8542.31.00.01

Compare

Microcontrollers and Processors

Texas Instruments

Yes

Yes

Active

32

456 MHz

172032

16

23

30 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

80

8

1.35 V

1.25 V

OTHER

S-PBGA-B361

e1

3

90 °C

260

30

361

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

650 µm

BOTTOM

1.3 mm

13 mm

13 mm

TEXAS INSTRUMENTS INC

LFBGA,

compliant

3A991.A.2

8542.31.00.01