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IS61WV12816DBLL-10TLI-TR
Integrated Silicon Solution Inc
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$0.6944 | Yes | Yes | Active | 2.0972 Mbit | 16 | 128KX16 | 3 V | 10 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 70 µA | 2 V | 65 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2, TSOP44,.46,32 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS61WV25616EDBLL-10BLI-TR
Integrated Silicon Solution Inc
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$1.0060 | Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3 V | 10 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 35 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | BALL | 750 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INTEGRATED SILICON SOLUTION INC | TFBGA, BGA48,6X8,30 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS61WV25616EDBLL-8TLI-TR
Integrated Silicon Solution Inc
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$2.1692 | Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3 V | 8 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 45 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2, TSOP44,.46,32 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS61WV25616EDBLL-10BLI
Integrated Silicon Solution Inc
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$3.3843 | Yes | Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3 V | 10 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 35 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | BALL | 750 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INTEGRATED SILICON SOLUTION INC | TFBGA, BGA48,6X8,30 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS61WV25616EDBLL-8TLI
Integrated Silicon Solution Inc
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$4.0713 | Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 8 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 45 µA | 3.63 V | 2.97 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2, TSOP44,.46,32 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS61WV25616EDBLL-8BLI
Integrated Silicon Solution Inc
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$5.1893 | Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 8 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 45 µA | 3.63 V | 2.97 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | BALL | 750 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INTEGRATED SILICON SOLUTION INC | TFBGA, BGA48,6X8,30 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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70V3399S133BF
Integrated Device Technology Inc
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$73.7305 | No | No | Transferred | 2.3593 Mbit | 18 | 128KX18 | 3.3 V | 4.2 ns | 133 MHz | APPLICATION SPECIFIC SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 2 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.15 V | 400 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e0 | 3 | 70 °C | 225 | 20 | 208 | PLASTIC/EPOXY | BGA | BGA208,17X17,32 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 800 µm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | FPBGA-208 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | CABGA | 208 | BF208 | ||||||||
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IDT70V3389S5BFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 1.1796 Mbit | 18 | 64KX18 | 5 ns | 100 MHz | APPLICATION SPECIFIC SRAM | COMMON | 2 | 64000 | 65.536 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 360 µA | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | FBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||||
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70V15S20J8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 3.3 V | 20 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 mA | 3 V | 200 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQCC-J68 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | QCCJ, LDCC68,1.0SQ | not_compliant | EAR99 | 8542.32.00.41 | |||||||||||||
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MCM67P618FN6
Motorola Mobility LLC
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Check for Price | No | No | Obsolete | 1.1796 Mbit | 18 | 64KX18 | 5 V | 6 ns | APPLICATION SPECIFIC SRAM | SELF-TIMED WRITE; BYTE WRITE; ASYN OR SYN MODE OF OPERATION | COMMON | 1 | 1 | 64000 | 65.536 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 360 µA | 5.5 V | 4.5 V | BICMOS | COMMERCIAL | S-PQCC-J52 | Not Qualified | e0 | 70 °C | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.57 mm | 19.1262 mm | 19.1262 mm | MOTOROLA INC | QCCJ, LDCC52,.8SQ | unknown | 3A991.B.2.A | 8542.32.00.41 | LCC | 52 |