Parametric results for: cs-1205 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 21 STANDARD: UL 94V-0 28

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1.3 inch 52

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0.13 inch 52

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1.3 inch 52

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13X13 52

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AU ON NI 14 GOLD OVER NICKEL 14 SN-PB ON NI 10 TIN LEAD OVER NICKEL 14

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Gold (Au) - with Nickel (Ni) barrier 20 GOLD OVER NICKEL 4 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 28

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Contact Material (3)

BE-CU 24 BERYLLIUM COPPER 1 BERYLLIUM COPPER ALLOY 27

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RND PIN-SKT 52

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IC SOCKET 52

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PGA120 46 PGA180 3 PGA320 3

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GLASS FILLED THERMOPLASTIC 24 THERMOPLASTIC POLYESTER 28

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e0 28 e4 24

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Manufacturer (2)

Advanced Interconnections Corp 52 CIT Relay & Switch 1

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0.1 inch 52

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STRAIGHT 52

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Number of Contacts (1)

120 52

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140.0 °C 24 150.0 °C 3 260.0 °C 21

Min (°C) - Max (°C)

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-60.0 °C 48

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RECTANGULAR 52

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100 µm 52

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Contact Manufacturer 1 Obsolete 52

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No 52

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Terminal Pitch (1)

2.54 mm 52

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SOLDER 52

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