Parametric results for: cs-361 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 15 HIGH TEMP 12 STANDARD: UL 94V-0 20

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1.9 inch 64

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0.085 inch 2 0.095 inch 6 0.12 inch 8 0.13 inch 8 0.165 inch 40

Min (inch) - Max (inch)

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1.9 inch 64

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19X19 64

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AU ON NI 22 GOLD OVER NICKEL 10 SN-PB ON NI 22 TIN LEAD OVER NICKEL 10

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Gold (Au) - with Nickel (Ni) barrier 32 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 32

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Contact Material (3)

BE-CU 44 BERYLLIUM COPPER 4 BERYLLIUM COPPER ALLOY 16

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RND PIN-SKT 64

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IC SOCKET 64

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PGA361 64

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GLASS FILLED EPOXY 2 GLASS FILLED THERMOPLASTIC 42 THERMOPLASTIC POLYESTER 20

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e0 34 e4 32

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Manufacturer (2)

Advanced Interconnections Corp 64 Cherry Semiconductor Corporation 6

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0.1 inch 64

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STRAIGHT 64

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Number of Contacts (1)

361 64

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70.0 °C 2 85.0 °C 4 140.0 °C 32 150.0 °C 5 260.0 °C 27

Min (°C) - Max (°C)

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-60.0 °C 64 -25.0 °C 4 0.0 °C 2

Min (°C) - Max (°C)

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RECTANGULAR 64

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100 µm 64

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Obsolete 68 Transferred 2

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No 66

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Terminal Pitch (2)

1.27 mm 1 2.54 mm 65

Min (mm) - Max (mm)

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SOLDER 64

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