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CS070-29TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 70 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA190 | STANDARD: UL 94V-0 | e0 | 140 °C | -60 °C | 11X11 | TIN LEAD OVER NICKEL | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | THERMOPLASTIC POLYESTER | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | not_compliant | EAR99 | 8536.69.40.40 | ||
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HCS070-29GT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 70 | BE-CU | 2.54 mm | IC SOCKET | PGA70 | e4 | 150 °C | -60 °C | 11X11 | SN-PB ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||
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CS070-29GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 70 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA190 | STANDARD: UL 94V-0 | e4 | 140 °C | -60 °C | 11X11 | GOLD OVER NICKEL | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | THERMOPLASTIC POLYESTER | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | not_compliant | EAR99 | 8536.69.40.40 | ||
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2CS070-29TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 70 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA70 | STANDARD: UL 94V-0 | e0 | 140 °C | -60 °C | 11X11 | TIN LEAD OVER NICKEL | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | THERMOPLASTIC POLYESTER | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | not_compliant | EAR99 | 8536.69.40.40 | ||
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HCS070-29TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 70 | BE-CU | 2.54 mm | IC SOCKET | PGA70 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 11X11 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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CS070-29TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 70 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA190 | STANDARD: UL 94V-0 | e0 | 140 °C | -60 °C | 11X11 | GOLD OVER NICKEL | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | THERMOPLASTIC POLYESTER | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | not_compliant | EAR99 | 8536.69.40.40 | ||
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2-HCS070-29TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 70 | BE-CU | 2.54 mm | IC SOCKET | PGA70 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 11X11 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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2HCS070-29GT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 70 | BE-CU | 2.54 mm | IC SOCKET | PGA70 | e4 | 150 °C | -60 °C | 11X11 | SN-PB ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||
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CS070-29GT
Advanced Interconnections Corp
|
Check for Price | No | Obsolete | 70 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA190 | STANDARD: UL 94V-0 | e4 | 140 °C | -60 °C | 11X11 | TIN LEAD OVER NICKEL | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | THERMOPLASTIC POLYESTER | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | not_compliant | EAR99 | 8536.69.40.40 | ||
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1-HCS070-29GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 70 | BE-CU | 2.54 mm | IC SOCKET | PGA70 | 2.5 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 11X11 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 |