Parametric results for: cs116, under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Current Rating Device Socket Type Device Type Used On Dielectric Withstanding Voltage Housing Material Insulation Resistance JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 30 STANDARD: UL 94V-0 40

117 hits Apply

0.4 inch 3 1.1 inch 111

Min (inch) - Max (inch)

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0.095 inch 17 0.12 inch 17 0.13 inch 19 0.165 inch 58 0.2 inch 1 0.205 inch 2

Min (inch) - Max (inch)

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0.56 inch 1 0.8 inch 2 1.1 inch 111

Min (inch) - Max (inch)

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11X11 111

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AU 24 AU ON NI 20 GOLD OVER NICKEL 19 NOT SPECIFIED 1 SN 15 SN-PB ON NI 15 TIN LEAD OVER NICKEL 20

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Gold (Au) - with Nickel (Ni) barrier 48 GOLD OVER NICKEL 5 TIN LEAD OVER NICKEL 1 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 57

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Contact Material (5)

BE-CU 71 BERYLLIUM COPPER 12 BERYLLIUM COPPER ALLOY 27 BRASS 1 P-CUSN 3

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BELLOWED TYPE 2 LEAF 1 RND PIN-SKT 111

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Current Rating (1)

1 A 3

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IC SOCKET 114

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DIP16 3 PGA116 91 PGA196 20

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1000VAC V 2 600VAC V 1

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GLASS FILLED EPOXY 2 GLASS FILLED POLYBUTYLENE TEREPHTHALATE 3 GLASS FILLED THERMOPLASTIC 69 THERMOPLASTIC POLYESTER 40

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1 GΩ 3

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e0 61 e4 53

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Manufacturer (3)

Advanced Interconnections Corp 111 Cherry Semiconductor Corporation 3 Marktech Optoelectronics 3

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0.07 inch 1 0.1 inch 113

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STRAIGHT 114

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Number of Contacts (2)

16 3 116 111

Min - Max

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70.0 °C 3 85.0 °C 3 140.0 °C 47 150.0 °C 5 260.0 °C 54

Min (°C) - Max (°C)

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-60.0 °C 106 -40.0 °C 3 0.0 °C 3

Min (°C) - Max (°C)

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RECTANGULAR 114

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100 µm 111 300 µm 3

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Active 3 Obsolete 113 Transferred 1

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No 114

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Terminal Pitch (3)

1.27 mm 2 1.778 mm 1 2.54 mm 114

Min (mm) - Max (mm)

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SOLDER 114

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