Parametric results for: cs3210 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 6 STANDARD: UL 94V-0 8

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2.1 inch 12

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0.12 inch 6 0.165 inch 6

Min (inch) - Max (inch)

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2.1 inch 12

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21X21 12

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AU ON NI 4 GOLD OVER NICKEL 4 SN-PB ON NI 2 TIN LEAD OVER NICKEL 4

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Gold (Au) - with Nickel (Ni) barrier 4 GOLD OVER NICKEL 2 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 8

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Contact Material (2)

BE-CU 6 BERYLLIUM COPPER ALLOY 8

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RND PIN-SKT 12

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IC SOCKET 14

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PGA321 6 PGA361 8

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GLASS FILLED THERMOPLASTIC 6 THERMOPLASTIC POLYESTER 8

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e0 8 e4 6

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Manufacturer (1)

Advanced Interconnections Corp 14

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0.1 inch 12

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STRAIGHT 12

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Number of Contacts (1)

321 14

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140.0 °C 6 260.0 °C 6

Min (°C) - Max (°C)

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-60.0 °C 12

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RECTANGULAR 12

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100 µm 12

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Obsolete 14

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No 14

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Terminal Pitch (1)

2.54 mm 12

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SOLDER 12

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