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DG307AAK/883
Vishay Siliconix
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Check for Price | No | No | Transferred | 15 V | NO | -15 V | SPDT | CMOS | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SILICONIX INC | DIP | DIP, DIP14,.3 | 14 | unknown | 8542.39.00.01 | |||||||||||||||
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DG307AAK
Temic Semiconductors
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Check for Price | Transferred | 15 V | NO | -15 V | 50 Ω | 250 ns | 150 ns | SPDT | CMOS | 1 | 2 | 62 dB | 100 µA | MILITARY | R-GDIP-T14 | Not Qualified | 125 °C | -55 °C | 14 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | TEMIC SEMICONDUCTORS | unknown | |||||||||||||||||||||||
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DG307AAK/HR
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 15 V | NO | -15 V | SPDT | CMOS | 1 | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 240 | MIL-STD-883 Class B (Modified) | 20 | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | MAXIM INTEGRATED PRODUCTS INC | not_compliant | 8542.39.00.01 | |||||||||||||||
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DG307AAK
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 15 V | NO | -15 V | SPDT | CMOS | 1 | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | e0 | 125 °C | -55 °C | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | MAXIM INTEGRATED PRODUCTS INC | DIP, DIP14,.3 | not_compliant | 8542.39.00.01 | EAR99 | |||||||||||||||||
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DG307AAK/883
Maxim Integrated Products
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Check for Price | No | Transferred | 15 V | NO | -15 V | SPDT | CMOS | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | MAXIM INTEGRATED PRODUCTS INC | not_compliant | 8542.39.00.01 | |||||||||||||||||||
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DG307AAK/883
Temic Semiconductors
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Check for Price | Transferred | 15 V | NO | -15 V | 50 Ω | 250 ns | 150 ns | SPDT | CMOS | 1 | 2 | 62 dB | 100 µA | MILITARY | R-GDIP-T14 | Not Qualified | 125 °C | -55 °C | 14 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | TEMIC SEMICONDUCTORS | unknown | |||||||||||||||||||||||
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DG307AAK
Vishay Siliconix
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Check for Price | No | No | Transferred | 15 V | NO | -15 V | SPDT | CMOS | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SILICONIX INC | DIP | DIP, DIP14,.3 | 14 | unknown | 8542.39.00.01 | ||||||||||||||||
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DG307AAK/883B
Maxim Integrated Products
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Check for Price | No | No | Transferred | 15 V | NO | -15 V | 75 Ω | 250 ns | SPDT | CMOS | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | MAXIM INTEGRATED PRODUCTS INC | DIP, DIP14,.3 | not_compliant | 8542.39.00.01 | EAR99 | |||||||||||||
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DG307AAK/883B
Analog Devices Inc
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Check for Price | Active | 15 V | NO | -15 V | 75 Ω | 250 ns | SPDT | CMOS | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 1 | 125 °C | -55 °C | NOT SPECIFIED | 38535Q/M;38534H;883B | NOT SPECIFIED | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 14-CERDIP-300_MIL | 14 | 14-CERDIP-300_MIL | 1988-02-01 | Analog Devices |