Parametric results for: dip30 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Current Rating Device Socket Type Device Type Used On Dielectric Withstanding Voltage Housing Material Insulation Resistance JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Pbfree Code Rohs Code Terminal Pitch Termination Type

DIP SOCKET 10

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0.4 inch 45

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0.165 inch 24 0.372 inch 3 0.423 inch 3 0.488 inch 6 0.568 inch 3 0.581 inch 3 0.699 inch 3

Min (inch) - Max (inch)

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0.2 inch 9 0.3 inch 17 0.4 inch 19

Min (inch) - Max (inch)

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RECTANGLE 26

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AU 3 AU ON NI 26 GOLD (10) OVER NICKEL (50) 1 GOLD (30) OVER NICKEL 1 GOLD (30) OVER NICKEL (50) 1 GOLD OVER NICKEL 2 NOT SPECIFIED 11 SN ON NI 1 TIN (100) OVER NICKEL 1

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GOLD 27 GOLD (30) OVER NICKEL 13 GOLD OVER NICKEL 3 Tin (Sn) - with Nickel (Ni) barrier 2 TIN OVER NICKEL 1 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 4

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Contact Material (3)

BE-CU 31 BERYLLIUM COPPER 4 NOT SPECIFIED 12

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RND PIN-SKT 45

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Current Rating (2)

2 A 5 3 A 22

Min (A) - Max (A)

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IC SOCKET 230

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DIP6 23 DIP8 38

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1000VAC V 27

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FLUOROPOLYMER 10 GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 12 PLASTIC 6 POLYPHENYLENE SULFIDE 6 THERMOPLASTIC 27

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10 GΩ 27

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e0 4 e3 3 e4 16

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Manufacturer (2)

Amphenol Communications Solutions 13 Amphenol FCi 217

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0.1 inch 45

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STRAIGHT 45

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Number of Contacts (2)

6 23 8 38

Min - Max

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150.0 °C 27

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-55.0 °C 27

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RECTANGULAR 45

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300 µm 45

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Active 26 Obsolete 204

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Yes 2

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No 2 Yes 12

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Terminal Pitch (1)

2.54 mm 45

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SOLDER 45

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