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Parametric results for: dspic33fj32gs406t-50e/mr under Microcontrollers

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Manufacturer Part Number: dspic33fj32gs406t50

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Select Parts		Part Number

		DSPIC33FJ32GS406T-50I/PT Microchip Technology Inc
		DSPIC33FJ32GS406T-50I/MR Microchip Technology Inc

			Most Relevant				Technical										Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Barrel Shifter	Format	Internal Bus Architecture	On Chip Program ROM Width	ROM Programmability	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Yes

Active

16

40 MHz

YES

3.3 V

DIGITAL SIGNAL PROCESSOR, CONTROLLER

CMOS

YES

FLOATING POINT

MULTIPLE

8

FLASH

3.6 V

3 V

INDUSTRIAL

S-PQFP-G64

Not Qualified

e3

85 °C

-40 °C

TS 16949

64

PLASTIC/EPOXY

TFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

MATTE TIN

GULL WING

500 µm

QUAD

1.2 mm

10 mm

10 mm

MICROCHIP TECHNOLOGY INC

TFQFP, TQFP64,.47SQ

compliant

3A991.A.2

8542.31.00.01

Yes

Active

16

40 MHz

YES

3.3 V

DIGITAL SIGNAL PROCESSOR, CONTROLLER

CMOS

FLOATING POINT

8

FLASH

3.6 V

3 V

INDUSTRIAL

S-PQCC-N64

Not Qualified

e3

3

85 °C

-40 °C

260

TS 16949

40

64

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

1 mm

9 mm

9 mm

MICROCHIP TECHNOLOGY INC

QFN-64

compliant

3A991.A.2

8542.31.00.01

Compare

DSPIC33FJ32GS406T-50I/PT

Microchip Technology Inc

Yes

Active

16

40 MHz

YES

3.3 V

DIGITAL SIGNAL PROCESSOR, CONTROLLER

CMOS

YES

FLOATING POINT

MULTIPLE

8

FLASH

3.6 V

3 V

INDUSTRIAL

S-PQFP-G64

Not Qualified

e3

85 °C

-40 °C

TS 16949

64

PLASTIC/EPOXY

TFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

MATTE TIN

GULL WING

500 µm

QUAD

1.2 mm

10 mm

10 mm

MICROCHIP TECHNOLOGY INC

TFQFP, TQFP64,.47SQ

compliant

3A991.A.2

8542.31.00.01

DSPIC33FJ32GS406T-50I/MR

Microchip Technology Inc

Yes

Active

16

40 MHz

YES

3.3 V

DIGITAL SIGNAL PROCESSOR, CONTROLLER

CMOS

FLOATING POINT

8

FLASH

3.6 V

3 V

INDUSTRIAL

S-PQCC-N64

Not Qualified

e3

3

85 °C

-40 °C

260

TS 16949

40

64

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

1 mm

9 mm

9 mm

MICROCHIP TECHNOLOGY INC

QFN-64

compliant

3A991.A.2

8542.31.00.01