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FSA4159L6X
onsemi
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$0.3781 | Yes | Obsolete | 1.8 V | YES | 2 Ω | 150 mΩ | 75 ns | 50 ns | SPDT | CMOS | 1 | 1 | 60 dB | 5.5 V | 1.65 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBCC-B6 | Not Qualified | e4 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 6 | PLASTIC/EPOXY | VBCC | SOLCC6,.04,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | BUTT | 500 µm | BOTTOM | 1.45 mm | 550 µm | 1 mm | ONSEMI | MICROPAK-6 | 127EB | compliant | 8542.39.00.01 | onsemi | ||||||
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FSA4159L6X
Fairchild Semiconductor Corporation
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Check for Price | Yes | Yes | Transferred | 1.8 V | YES | 2 Ω | 150 mΩ | 75 ns | 50 ns | SPDT | CMOS | 1 | 1 | 60 dB | 5.5 V | 1.65 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBCC-B6 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VBCC | SOLCC6,.04,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | BUTT | 500 µm | BOTTOM | 1.45 mm | 550 µm | 1 mm | FAIRCHILD SEMICONDUCTOR CORP | 1 MM, MO-252UAAD, GREEN, MICROPAK-6 | 6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED) | compliant | 8542.39.00.01 | MICROPAK MLP | 6 | EAR99 | |||
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FSA4159L6X
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 1.8 V | YES | 2 Ω | 150 mΩ | 75 ns | 50 ns | SPDT | CMOS | 1 | 1 | 60 dB | 5.5 V | 1.65 V | INDUSTRIAL | R-PDSO-N6 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 1.45 mm | 550 µm | 1 mm | ROCHESTER ELECTRONICS INC | VSON, | unknown | SON | 6 | |||||||||
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FSA4159L6X-F113
Fairchild Semiconductor Corporation
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Check for Price | Yes | Obsolete | YES | 3.5 Ω | 75 ns | SPDT | CMOS | 1 | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PDSO-N6 | Not Qualified | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | SON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE | NO LEAD | 500 µm | DUAL | FAIRCHILD SEMICONDUCTOR CORP | SON, SOLCC6,.04,20 | unknown | 8542.39.00.01 |