Parametric results for: hcs02ms under Sockets and Chip Carriers

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Manufacturer Part Number: hcs02
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HCS029-29GG
Advanced Interconnections Corp
Check for Price No Obsolete 29 BE-CU 2.54 mm IC SOCKET PGA29 2.5 OZ. AVG. INSERTION FORCE e4 260 °C -60 °C 6X6 AU ON NI Gold (Au) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 0.6 inch 0.6 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
3-HCS028-49GG
Advanced Interconnections Corp
Check for Price No Obsolete 28 BE-CU 2.54 mm IC SOCKET PGA28 2.5 OZ. AVG. INSERTION FORCE e4 260 °C -60 °C 6X6 AU ON NI Gold (Au) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.095 inch 0.6 inch 0.6 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
2-HCS020-51GG
Advanced Interconnections Corp
Check for Price No Obsolete 20 BE-CU 2.54 mm IC SOCKET PGA20 2.5 OZ. AVG. INSERTION FORCE e4 260 °C -60 °C 5X5 AU ON NI Gold (Au) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.13 inch 0.5 inch 0.5 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
1-HCS021-04TG
Advanced Interconnections Corp
Check for Price No Obsolete 21 BE-CU 2.54 mm IC SOCKET PGA21 2.5 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 5X5 AU ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.12 inch 0.5 inch 0.5 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCS020-49TT
Advanced Interconnections Corp
Check for Price No Obsolete 20 BE-CU 2.54 mm IC SOCKET PGA20 2.5 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 5X5 SN-PB ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.095 inch 0.5 inch 0.5 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
4-HCS028-29TG
Advanced Interconnections Corp
Check for Price No Obsolete 28 BE-CU 2.54 mm IC SOCKET PGA28 2.5 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 6X6 AU ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 0.6 inch 0.6 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
2-HCS020-29GG
Advanced Interconnections Corp
Check for Price No Obsolete 20 BE-CU 2.54 mm IC SOCKET PGA20 2.5 OZ. AVG. INSERTION FORCE e4 260 °C -60 °C 5X5 AU ON NI Gold (Au) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 0.5 inch 0.5 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCS028-51TT
Advanced Interconnections Corp
Check for Price No Obsolete 28 BE-CU 2.54 mm IC SOCKET PGA28 2.5 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 6X6 SN-PB ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.13 inch 0.6 inch 0.6 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCS029-01TT
Advanced Interconnections Corp
Check for Price No Obsolete 29 BE-CU 2.54 mm IC SOCKET PGA29 2.5 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 6X6 SN-PB ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 0.6 inch 0.6 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCS022-04GG
Advanced Interconnections Corp
Check for Price No Obsolete 22 BE-CU 2.54 mm IC SOCKET PGA22 2.5 OZ. AVG. INSERTION FORCE e4 260 °C -60 °C 5X5 AU ON NI Gold (Au) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.12 inch 0.5 inch 0.5 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40