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HCS029-29GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 29 | BE-CU | 2.54 mm | IC SOCKET | PGA29 | 2.5 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 6X6 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 0.6 inch | 0.6 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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3-HCS028-49GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 28 | BE-CU | 2.54 mm | IC SOCKET | PGA28 | 2.5 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 6X6 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.095 inch | 0.6 inch | 0.6 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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2-HCS020-51GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 20 | BE-CU | 2.54 mm | IC SOCKET | PGA20 | 2.5 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 5X5 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.13 inch | 0.5 inch | 0.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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1-HCS021-04TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 21 | BE-CU | 2.54 mm | IC SOCKET | PGA21 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 5X5 | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 0.5 inch | 0.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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HCS020-49TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 20 | BE-CU | 2.54 mm | IC SOCKET | PGA20 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 5X5 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.095 inch | 0.5 inch | 0.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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4-HCS028-29TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 28 | BE-CU | 2.54 mm | IC SOCKET | PGA28 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 6X6 | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 0.6 inch | 0.6 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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2-HCS020-29GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 20 | BE-CU | 2.54 mm | IC SOCKET | PGA20 | 2.5 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 5X5 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 0.5 inch | 0.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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HCS028-51TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 28 | BE-CU | 2.54 mm | IC SOCKET | PGA28 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 6X6 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.13 inch | 0.6 inch | 0.6 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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HCS029-01TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 29 | BE-CU | 2.54 mm | IC SOCKET | PGA29 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 6X6 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 0.6 inch | 0.6 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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HCS022-04GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 22 | BE-CU | 2.54 mm | IC SOCKET | PGA22 | 2.5 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 5X5 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 0.5 inch | 0.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 |