Findchips: Parametric Search Results for hcs21

Parametric results for: hcs21 under Gates

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		5962R9577901V9A Harris Semiconductor
		HCS216-01TG Advanced Interconnections Corp
		HCS215-51TT Advanced Interconnections Corp
		HCS212-01GG Advanced Interconnections Corp
		1-HCS215-49TT Advanced Interconnections Corp
		1-HCS215-49TG Advanced Interconnections Corp
		5962R9577901V9X Intersil Corporation
		HCS212-344TG Advanced Interconnections Corp
		1-HCS215-01GG Advanced Interconnections Corp
		HCS211-29TG Advanced Interconnections Corp

			Most Relevant			Technical			Compliance	Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Number of Contacts	Contact Material	Terminal Pitch	Device Socket Type	Device Type Used On	Additional Feature	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Contact Configuration	Contact Finish Mating	Contact Finish Termination	Contact Style	Housing Material	Mating Contact Pitch	Mounting Style	PCB Contact Pattern	PCB Contact Row Spacing	Termination Type	Body Depth	Body Breadth	Body Length	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Family	JESD-30 Code	Load Capacitance (CL)	Logic IC Type	Number of Functions	Number of Inputs	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Propagation Delay (tpd)	Qualification Status	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Nom (Vsup)	Surface Mount	Technology	Temperature Grade	Terminal Finish	Terminal Form	Terminal Position	Total Dose	ECCN Code	Part Package Code	Pin Count	Screening Level

Check for Price

Transferred

125 °C

-55 °C

HARRIS SEMICONDUCTOR

DIE,

unknown

8542.39.00.01

HC/UH

X-XUUC-N14

50 pF

AND GATE

UNSPECIFIED

DIE

DIE OR CHIP

UNSPECIFIED

UNCASED CHIP

20 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

MILITARY

TIN LEAD

NO LEAD

UPPER

100k Rad(Si) V

Check for Price

Obsolete

216

BE-CU

2.54 mm

IC SOCKET

PGA216

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

21X21

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.1 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.13 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

Check for Price

Obsolete

212

BE-CU

2.54 mm

IC SOCKET

PGA212

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

Check for Price

Obsolete

125 °C

-55 °C

INTERSIL CORP

DIE,

unknown

8542.39.00.01

HC/UH

R-XUUC-N14

AND GATE

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

22 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

MILITARY

NO LEAD

UPPER

100k Rad(Si) V

DIE

MIL-PRF-38535 Class V

Check for Price

Obsolete

212

BE-CU

2.54 mm

IC SOCKET

PGA212

260 °C

-60 °C

15X15

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

Check for Price

Obsolete

211

BE-CU

2.54 mm

IC SOCKET

PGA211

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

17X17

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.7 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

1 2 3 4 5 Next

Compare

5962R9577901V9A

Harris Semiconductor

Check for Price

Transferred

125 °C

-55 °C

HARRIS SEMICONDUCTOR

DIE,

unknown

8542.39.00.01

HC/UH

X-XUUC-N14

50 pF

AND GATE

UNSPECIFIED

DIE

DIE OR CHIP

UNSPECIFIED

UNCASED CHIP

20 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

MILITARY

TIN LEAD

NO LEAD

UPPER

100k Rad(Si) V

HCS216-01TG

Advanced Interconnections Corp

Check for Price

Obsolete

216

BE-CU

2.54 mm

IC SOCKET

PGA216

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

21X21

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.1 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

HCS215-51TT

Advanced Interconnections Corp

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.13 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

HCS212-01GG

Advanced Interconnections Corp

Check for Price

Obsolete

212

BE-CU

2.54 mm

IC SOCKET

PGA212

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

1-HCS215-49TT

Advanced Interconnections Corp

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

1-HCS215-49TG

Advanced Interconnections Corp

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

5962R9577901V9X

Intersil Corporation

Check for Price

Obsolete

125 °C

-55 °C

INTERSIL CORP

DIE,

unknown

8542.39.00.01

HC/UH

R-XUUC-N14

AND GATE

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

22 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

MILITARY

NO LEAD

UPPER

100k Rad(Si) V

DIE

MIL-PRF-38535 Class V

HCS212-344TG

Advanced Interconnections Corp

Check for Price

Obsolete

212

BE-CU

2.54 mm

IC SOCKET

PGA212

260 °C

-60 °C

15X15

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

1-HCS215-01GG

Advanced Interconnections Corp

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

15X15

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

HCS211-29TG

Advanced Interconnections Corp

Check for Price

Obsolete

211

BE-CU

2.54 mm

IC SOCKET

PGA211

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

17X17

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.7 inch

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

1 2 3 4 5 Next