Parametric results for: hcs212 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 15

32 hits Apply

1.5 inch 32

32 hits Apply

0.095 inch 4 0.12 inch 4 0.13 inch 4 0.165 inch 20

Min (inch) - Max (inch)

32 hits Apply

1.5 inch 32

32 hits Apply

15X15 32

32 hits Apply

AU 6 AU ON NI 10 SN-PB 6 SN-PB ON NI 10

32 hits Apply

Gold (Au) - with Nickel (Ni) barrier 16 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 16

32 hits Apply

Contact Material (1)

BE-CU 32

32 hits Apply

RND PIN-SKT 32

32 hits Apply

IC SOCKET 32

32 hits Apply

PGA212 32

32 hits Apply

GLASS FILLED EPOXY 2 GLASS FILLED THERMOPLASTIC 30

32 hits Apply

e0 16 e4 16

32 hits Apply

Manufacturer (1)

Advanced Interconnections Corp 32

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0.1 inch 32

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STRAIGHT 32

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Number of Contacts (1)

212 32

32 hits Apply

150.0 °C 5 260.0 °C 27

Min (°C) - Max (°C)

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-60.0 °C 32

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RECTANGULAR 32

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100 µm 32

32 hits Apply

Obsolete 32

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No 32

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Terminal Pitch (1)

2.54 mm 32

32 hits Apply

SOLDER 32

32 hits Apply