Parametric results for: hlss004236tg under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern Part Life Cycle Code Pbfree Code Rohs Code Terminal Pitch Termination Type

STANDARD: UL 94V-0 84

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0.1 inch 37

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0.095 inch 12 0.13 inch 12 0.165 inch 13

Min (inch) - Max (inch)

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2.0 inch 13 3.0 inch 12 3.2 inch 12

Min (inch) - Max (inch)

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AU ON NI 13 GOLD OVER NICKEL 13 NOT SPECIFIED 31 SN-PB ON NI 12 TIN LEAD OVER NICKEL 25

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Gold (Au) - with Nickel (Ni) barrier 28 GOLD OVER NICKEL 32 TIN LEAD OVER NICKEL 22 TIN OVER NICKEL 1 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 38

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Contact Material (5)

BE-CU 1 BERYLLIUM COPPER 2 BERYLLIUM COPPER ALLOY 36 BRASS 25 NOT SPECIFIED 30

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RND PIN-SKT 37

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IC SOCKET 121

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SIP20 41 SIP30 40 SIP32 40

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GLASS FILLED THERMOPLASTIC 12 POLYETHYLENE 84 POLYIMIDE 24

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e0 60 e4 60

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Manufacturer (1)

Advanced Interconnections Corp 121

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0.1 inch 37

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STRAIGHT 37

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Number of Contacts (3)

20 41 30 40 32 40

Min - Max

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220.0 °C 1 260.0 °C 36

Min (°C) - Max (°C)

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-60.0 °C 37

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RECTANGULAR 37

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Active 36 Obsolete 85

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No 22 Yes 1

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No 85 Yes 9

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Terminal Pitch (1)

2.54 mm 37

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SOLDER 37

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