Findchips: Parametric Search Results for ics853p022aglf


Select Parts		Part Number

		ICS853P022AGLF Integrated Device Technology Inc
		ICS853P022AGLFT Integrated Circuit Systems Inc
		ICS853P022AGLFT Integrated Device Technology Inc
		ICS853P022AGLF Integrated Circuit Systems Inc

				Most Relevant		Technical									Compliance			Operating Conditions		Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Number of Bits	Interface IC Type	Additional Feature	Number of Functions	Output Latch or Register	Output Polarity	Supply Voltage-Max	Supply Voltage-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

3.3 V

TTL/CMOS TO PECL TRANSLATOR

ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V

NONE

COMPLEMENTARY

5.25 V

2.375 V

YES

INDUSTRIAL

S-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

3 mm

1.1 mm

3 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

3 X 3 MM, 0.95 MM HEIGHT, LEAD FREE, MO-187, TSSOP-8

unknown

EAR99

8542.39.00.01

Check for Price

Yes

Transferred

3.3 V

TTL/CMOS TO PECL TRANSLATOR

ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V

NONE

COMPLEMENTARY

5.25 V

2.375 V

YES

INDUSTRIAL

S-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

3 mm

1.1 mm

3 mm

INTEGRATED CIRCUIT SYSTEMS INC

3 X 3 MM, 0.95 MM HEIGHT, LEAD FREE, MO-187, TSSOP-8

unknown

Check for Price

Yes

Obsolete

3.3 V

TTL/CMOS TO PECL TRANSLATOR

ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V

NONE

COMPLEMENTARY

5.25 V

2.375 V

YES

INDUSTRIAL

S-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

3 mm

1.1 mm

3 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

3 X 3 MM, 0.95 MM HEIGHT, LEAD FREE, MO-187, TSSOP-8

unknown

EAR99

8542.39.00.01

Check for Price

Yes

Transferred

3.3 V

TTL/CMOS TO PECL TRANSLATOR

ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V

NONE

COMPLEMENTARY

5.25 V

2.375 V

YES

INDUSTRIAL

S-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

3 mm

1.1 mm

3 mm

INTEGRATED CIRCUIT SYSTEMS INC

3 X 3 MM, 0.95 MM HEIGHT, LEAD FREE, MO-187, TSSOP-8

unknown

Compare

ICS853P022AGLF

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

3.3 V

TTL/CMOS TO PECL TRANSLATOR

ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V

NONE

COMPLEMENTARY

5.25 V

2.375 V

YES

INDUSTRIAL

S-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

3 mm

1.1 mm

3 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

3 X 3 MM, 0.95 MM HEIGHT, LEAD FREE, MO-187, TSSOP-8

unknown

EAR99

8542.39.00.01

ICS853P022AGLFT

Integrated Circuit Systems Inc

Check for Price

Yes

Transferred

3.3 V

TTL/CMOS TO PECL TRANSLATOR

ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V

NONE

COMPLEMENTARY

5.25 V

2.375 V

YES

INDUSTRIAL

S-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

3 mm

1.1 mm

3 mm

INTEGRATED CIRCUIT SYSTEMS INC

3 X 3 MM, 0.95 MM HEIGHT, LEAD FREE, MO-187, TSSOP-8

unknown

ICS853P022AGLFT

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

3.3 V

TTL/CMOS TO PECL TRANSLATOR

ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V

NONE

COMPLEMENTARY

5.25 V

2.375 V

YES

INDUSTRIAL

S-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

3 mm

1.1 mm

3 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

3 X 3 MM, 0.95 MM HEIGHT, LEAD FREE, MO-187, TSSOP-8

unknown

EAR99

8542.39.00.01

ICS853P022AGLF

Integrated Circuit Systems Inc

Check for Price

Yes

Transferred

3.3 V

TTL/CMOS TO PECL TRANSLATOR

ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V

NONE

COMPLEMENTARY

5.25 V

2.375 V

YES

INDUSTRIAL

S-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

3 mm

1.1 mm

3 mm

INTEGRATED CIRCUIT SYSTEMS INC

3 X 3 MM, 0.95 MM HEIGHT, LEAD FREE, MO-187, TSSOP-8

unknown

Parametric results for: ics853p022aglf under Level Translators