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Parametric » Power Circuits » Power Management Circuits

Parametric results for: lp5553tl under Power Management Circuits

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Manufacturer Part Number: lp5553tl

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Select Parts		Part Number

		LP5553TL Texas Instruments
		LP5553TLX Texas Instruments

			Most Relevant			Technical	Compliance			Operating Conditions					Physical											Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Current-Max (Isup)	Surface Mount	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

3.6 V

930 µA

YES

INDUSTRIAL

S-PBGA-B36

e1

Not Qualified

1

85 °C

-40 °C

260

40

36

PLASTIC/EPOXY

FBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

NATIONAL SEMICONDUCTOR CORP

FBGA, BGA36,6X6,20

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Obsolete

3.6 V

930 µA

YES

INDUSTRIAL

S-PBGA-B36

e1

Not Qualified

1

85 °C

-40 °C

260

40

36

PLASTIC/EPOXY

FBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

NATIONAL SEMICONDUCTOR CORP

FBGA, BGA36,6X6,20

compliant

EAR99

8542.39.00.01

Compare

Texas Instruments

Check for Price

Yes

Obsolete

3.6 V

930 µA

YES

INDUSTRIAL

S-PBGA-B36

e1

Not Qualified

1

85 °C

-40 °C

260

40

36

PLASTIC/EPOXY

FBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

NATIONAL SEMICONDUCTOR CORP

FBGA, BGA36,6X6,20

compliant

EAR99

8542.39.00.01

Texas Instruments

Check for Price

Yes

Obsolete

3.6 V

930 µA

YES

INDUSTRIAL

S-PBGA-B36

e1

Not Qualified

1

85 °C

-40 °C

260

40

36

PLASTIC/EPOXY

FBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

NATIONAL SEMICONDUCTOR CORP

FBGA, BGA36,6X6,20

compliant

EAR99

8542.39.00.01