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LPC11U24FHI33/301Y
NXP Semiconductors
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$3.0050 | Yes | Active | 32 | 50 MHz | 32768 | 8192 | CORTEX-M0 | 25 MHz | 26 | YES | 3.3 V | MICROCONTROLLER, RISC | CMOS | SEATED HGT-NOM | NO | NO | YES | 8 | NO | FLASH | 3.6 V | 3.3 V | INDUSTRIAL | S-PQCC-N33 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 33 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 850 µm | 5 mm | 5 mm | NXP SEMICONDUCTORS | QFN | HVQCCN, | 32 | SOT617-3 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||
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LPC11U24FHI33/301
NXP Semiconductors
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Check for Price | Yes | Active | 32 | 50 MHz | 32768 | 8192 | CORTEX-M0 | 25 MHz | 26 | 4 | YES | 3.3 V | MICROCONTROLLER, RISC | CMOS | SEATED HGT-NOM | YES | NO | NO | FIXED POINT | YES | NO | YES | 1 | 8 | 8 | YES | FLASH | 3.6 V | 3.3 V | INDUSTRIAL | S-PQCC-N32 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 850 µm | 5 mm | 5 mm | NXP SEMICONDUCTORS | QFN | HVQFN-32 | 33 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP |