Parametric results for: ltc2635-h) under Digital to Analog Converters
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LTC2635HMSE-LZ8#PBF
Analog Devices Inc
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$6.0251 | No | Yes | Active | 3 V | 5.5 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 3.5 µs | CMOS | AUTOMOTIVE | S-PDSO-G10 | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | LEAD FREE, PLASTIC, MSOP-10 | 10 | 05-08-1664 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||||
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LTC2635HMSE-LZ12#PBF
Analog Devices Inc
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$11.6250 | No | Yes | Active | 3 V | 5.5 V | 0.061 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4.4 µs | CMOS | AUTOMOTIVE | S-PDSO-G10 | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | LEAD FREE, PLASTIC, MSOP-10 | 10 | 05-08-1664 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||||
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LTC2635HUD-LZ12#PBF
Analog Devices Inc
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$12.2252 | No | Yes | Active | 3 V | 5.5 V | 0.061 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4.4 µs | CMOS | AUTOMOTIVE | S-PQCC-N16 | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | ANALOG DEVICES INC | 3 X 3 MM, LEAD FREE, PLASTIC, MO-220WEED-2, QFN-16 | 16 | 05-08-1691 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||||
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LTC2635HMSE-HMX10#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 5 V | 4.096 V | 0.0977 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4.3 µs | CMOS | AUTOMOTIVE | S-PDSO-G10 | Not Qualified | e3 | 125 °C | -40 °C | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | LINEAR TECHNOLOGY CORP | HTSSOP, | 10 | compliant | 8542.39.00.01 | MSOP | |||||||||||
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LTC2635HMSE-LZ8#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 3 V | 2.5 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 3.5 µs | 900 µA | CMOS | AUTOMOTIVE | S-PDSO-G10 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | LINEAR TECHNOLOGY CORP | MSOP-10 | 10 | MSE | compliant | 8542.39.00.01 | MSOP | |||||
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LTC2635HMSE-HMX8#TRPBF
Analog Devices Inc
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Check for Price | Yes | Active | 5 V | 4.096 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 3.9 µs | CMOS | AUTOMOTIVE | S-PDSO-G10 | Not Qualified | e3 | 125 °C | -40 °C | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | HTSSOP, | compliant | 8542.39.00.01 | |||||||||||||
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LTC2635HMSE-HMO8#TRPBF
Analog Devices Inc
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Check for Price | Yes | Active | 5 V | 4.096 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 3.9 µs | CMOS | AUTOMOTIVE | S-PDSO-G10 | Not Qualified | e3 | 125 °C | -40 °C | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | HTSSOP, | compliant | 8542.39.00.01 | |||||||||||||
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LTC2635HMSE-LMI8#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 3 V | 2.5 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 3.5 µs | 900 µA | CMOS | AUTOMOTIVE | S-PDSO-G10 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | LINEAR TECHNOLOGY CORP | MSOP-10 | 10 | MSE | compliant | 8542.39.00.01 | MSOP | |||||
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LTC2635HUD-LMX10#PBF
Linear Technology
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Check for Price | Yes | Transferred | 3 V | 5.5 V | 0.0977 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4.1 µs | 900 µA | CMOS | AUTOMOTIVE | S-PQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | LINEAR TECHNOLOGY CORP | 3 X 3 MM, LEAD FREE, PLASTIC, MO-220WEED-2, QFN-16 | 16 | UD | compliant | 8542.39.00.01 | QFN | |||||
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LTC2635HUD-LMI12#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 3 V | 2.5 V | 0.061 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4.4 µs | 900 µA | CMOS | AUTOMOTIVE | S-PQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | LINEAR TECHNOLOGY CORP | QFN-16 | 16 | UD | compliant | 8542.39.00.01 | QFN |