Findchips: Parametric Search Results for m2s005s-vf256


Select Parts		Part Number

		M2S005S-VF256 Microsemi Corporation
		M2S005S-VF256I Microsemi Corporation
		M2S005S-VF256 Microchip Technology Inc
		M2S005S-VF256I Microchip Technology Inc

			Most Relevant						Technical				Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Number of Inputs	Number of Outputs	Number of Logic Cells	Programmable Logic Type	Package Shape	Technology	Additional Feature	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code

$18.6124

Transferred

1.2 V

161

6060

FIELD PROGRAMMABLE GATE ARRAY

SQUARE

CMOS

LG-MIN, WD-MIN

1.26 V

1.14 V

S-PBGA-B256

Not Qualified

85 °C

240

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

14 mm

1.56 mm

MICROSEMI CORP

LFBGA, BGA256,16X16,32

not_compliant

8542.39.00.01

$20.8402

Transferred

1.2 V

161

6060

FIELD PROGRAMMABLE GATE ARRAY

SQUARE

CMOS

LG-MIN, WD-MIN

1.26 V

1.14 V

S-PBGA-B256

Not Qualified

100 °C

-40 °C

240

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

14 mm

1.56 mm

MICROSEMI CORP

LFBGA, BGA256,16X16,32

not_compliant

8542.39.00.01

$26.6039

Active

1.2 V

161

6060

FPGA SOC

SQUARE

1.26 V

1.14 V

S-PBGA-B256

85 °C

240

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

14 mm

1.56 mm

MICROCHIP TECHNOLOGY INC

VFBGA-256

not_compliant

8542.31.00.01

$29.7971

Active

1.2 V

161

6060

FPGA SOC

SQUARE

1.26 V

1.14 V

S-PBGA-B256

100 °C

-40 °C

240

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

14 mm

1.56 mm

MICROCHIP TECHNOLOGY INC

VFBGA-256

not_compliant

8542.31.00.01

Compare

M2S005S-VF256

Microsemi Corporation

$18.6124

Transferred

1.2 V

161

6060

FIELD PROGRAMMABLE GATE ARRAY

SQUARE

CMOS

LG-MIN, WD-MIN

1.26 V

1.14 V

S-PBGA-B256

Not Qualified

85 °C

240

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

14 mm

1.56 mm

MICROSEMI CORP

LFBGA, BGA256,16X16,32

not_compliant

8542.39.00.01

M2S005S-VF256I

Microsemi Corporation

$20.8402

Transferred

1.2 V

161

6060

FIELD PROGRAMMABLE GATE ARRAY

SQUARE

CMOS

LG-MIN, WD-MIN

1.26 V

1.14 V

S-PBGA-B256

Not Qualified

100 °C

-40 °C

240

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

14 mm

1.56 mm

MICROSEMI CORP

LFBGA, BGA256,16X16,32

not_compliant

8542.39.00.01

M2S005S-VF256

Microchip Technology Inc

$26.6039

Active

1.2 V

161

6060

FPGA SOC

SQUARE

1.26 V

1.14 V

S-PBGA-B256

85 °C

240

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

14 mm

1.56 mm

MICROCHIP TECHNOLOGY INC

VFBGA-256

not_compliant

8542.31.00.01

M2S005S-VF256I

Microchip Technology Inc

$29.7971

Active

1.2 V

161

6060

FPGA SOC

SQUARE

1.26 V

1.14 V

S-PBGA-B256

100 °C

-40 °C

240

256

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

14 mm

1.56 mm

MICROCHIP TECHNOLOGY INC

VFBGA-256

not_compliant

8542.31.00.01

Parametric results for: m2s005s-vf256 under Field Programmable Gate Arrays