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1 - 10 of 19 results
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RFFM3482ETR7
RF Micro Devices Inc
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Check for Price | Yes | Transferred | 3.6 V | GAAS | TELECOM CIRCUIT | 1 | COMMERCIAL | S-XQCC-N16 | Not Qualified | 70 °C | -10 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 550 µm | RF MICRO DEVICES INC | HVQCCN, LCC16,.12SQ,20 | unknown | 5A991.G | 8517.62.00.50 | |||||||
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RFFM3482ESR
Qorvo
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Check for Price | Yes | Obsolete | 3.6 V | GAAS | TELECOM CIRCUIT | 1 | COMMERCIAL | S-XQCC-N16 | Not Qualified | 70 °C | -10 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 550 µm | QORVO INC | HVQCCN, LCC16,.12SQ,20 | compliant | 8542.39.00.01 | ||||||||
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RFFM3482QSQ
Qorvo
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Check for Price | Obsolete | 3.6 V | TELECOM CIRCUIT | 1 | S-XQCC-N16 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 550 µm | QORVO INC | HVQCCN, | compliant | 8542.39.00.01 | |||||||||||||||
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M3488F1
STMicroelectronics
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Check for Price | No | Obsolete | 5 V | CMOS | R-XDIP-T40 | e0 | Not Qualified | 40 | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | STMICROELECTRONICS | not_compliant | 8542.39.00.01 | |||||||||||||||
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RFFM3482QSR
RF Micro Devices Inc
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Check for Price | Transferred | 3.6 V | TELECOM CIRCUIT | 1 | S-XQCC-N16 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 550 µm | RF MICRO DEVICES INC | HVQCCN, | unknown | 5A991.G | 8517.62.00.50 | ||||||||||||||
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RFFM3482ESR
RF Micro Devices Inc
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Check for Price | Yes | Transferred | 3.6 V | GAAS | TELECOM CIRCUIT | 1 | COMMERCIAL | S-XQCC-N16 | Not Qualified | 70 °C | -10 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 550 µm | RF MICRO DEVICES INC | HVQCCN, LCC16,.12SQ,20 | unknown | 5A991.G | 8517.62.00.50 | |||||||
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M3488Q1
STMicroelectronics
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Check for Price | Yes | Obsolete | 5 V | CMOS | DIGITAL TIME SWITCH | 1 | 30 mA | COMMERCIAL | S-PQFP-G44 | e4 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | QFP | QFP44,.5SQ,32 | SQUARE | FLATPACK | YES | NICKEL PALLADIUM GOLD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 2.45 mm | STMICROELECTRONICS | 10 X 10 MM, PLASTIC, QFP-44 | compliant | 8542.39.00.01 | QFP | 44 | ||||
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RFFM3482QTR7
Qorvo
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Check for Price | Obsolete | 3.6 V | TELECOM CIRCUIT | 1 | S-XQCC-N16 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 550 µm | QORVO INC | HVQCCN, | compliant | 8542.39.00.01 | |||||||||||||||
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RFFM3482QTR13X
Qorvo
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Check for Price | Obsolete | 3.6 V | TELECOM CIRCUIT | 1 | S-XQCC-N16 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 550 µm | QORVO INC | HVQCCN, | compliant | 8542.39.00.01 | |||||||||||||||
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RFFM3482ESQ
Qorvo
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Check for Price | Yes | Obsolete | 3.6 V | GAAS | TELECOM CIRCUIT | 1 | COMMERCIAL | S-XQCC-N16 | Not Qualified | 70 °C | -10 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 550 µm | QORVO INC | HVQCCN, LCC16,.12SQ,20 | compliant | 8542.39.00.01 |