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MAX14589EEWL+T
Maxim Integrated Products
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$1.6738 | Yes | Yes | Transferred | 2.5 V | YES | 380 mΩ | 5 mΩ | 10 ms | 2.25 ms | DPDT | BICMOS | 5.5 V | -5.5 V | NC | 2 | 1 | 60 dB | COMMON OUTPUT | 60 µA | 5.5 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PBGA-B9 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,16 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER NICKEL | BALL | 400 µm | BOTTOM | 1.26 mm | 690 µm | 1.26 mm | MAXIM INTEGRATED PRODUCTS INC | , | compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX14589EEWL+T
Analog Devices Inc
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Check for Price | Yes | Active | 2.5 V | YES | 380 mΩ | 5 mΩ | 10 ms | 2.25 ms | DPDT | BICMOS | 5.5 V | -5.5 V | NC | 2 | 1 | 60 dB | COMMON OUTPUT | 60 µA | 5.5 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PBGA-B9 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,16 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 400 µm | BOTTOM | 1.26 mm | 690 µm | 1.26 mm | 9-WLCSP-N/A | 9 | 9-WLCSP-N/A | 2012-07-17 | Analog Devices | ||||||||
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MAX14589EEWL+TG2B
Maxim Integrated Products
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Check for Price | Transferred | DPDT | MAXIM INTEGRATED PRODUCTS INC | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||
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MAX14589EEWL+TG2B
Analog Devices Inc
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Check for Price | Obsolete | DPDT | ANALOG DEVICES INC | unknown |