Findchips: Parametric Search Results for max17043

Parametric results for: max17043 under Power Management Circuits

Select parts from the table below to compare.

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Select Parts		Part Number

		MAX17043X+T10 Maxim Integrated Products
		MAX17043G+T Maxim Integrated Products
		MAX17043G+T10W Maxim Integrated Products
		MAX17043X+ Maxim Integrated Products
		MAX17043G+TG075 Analog Devices Inc
		MAX17043X+U Maxim Integrated Products
		MAX17043X+W Maxim Integrated Products
		MAX17043X+T10 Analog Devices Inc
		MAX17043X+ Analog Devices Inc
		MAX17043G-E+U Maxim Integrated Products

				Most Relevant						Technical			Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,16

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PDSO-N8

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

MATTE TIN

NO LEAD

500 µm

DUAL

2 mm

3 mm

800 µm

MAXIM INTEGRATED PRODUCTS INC

DFN

HVSON, SOLCC8,.11,20

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Transferred

POWER SUPPLY MANAGEMENT CIRCUIT

260

MATTE TIN

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,16

compliant

EAR99

8542.39.00.01

Check for Price

Obsolete

POWER SUPPLY MANAGEMENT CIRCUIT

ANALOG DEVICES INC

unknown

Check for Price

Yes

Obsolete

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

S-PBGA-B9

Not Qualified

70 °C

-20 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.6 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

ROHS COMPLIANT, UCSP-9

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Obsolete

POWER SUPPLY MANAGEMENT CIRCUIT

260

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Active

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

9-WLCSP-N/A

2010-05-24

Analog Devices

Check for Price

Yes

Active

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

9-WLCSP-N/A

2010-05-24

Check for Price

Yes

Obsolete

POWER SUPPLY MANAGEMENT CIRCUIT

260

MATTE TIN

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

1 2 Next

Compare

MAX17043X+T10

Maxim Integrated Products

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,16

compliant

EAR99

8542.39.00.01

MAX17043G+T

Maxim Integrated Products

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PDSO-N8

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

MATTE TIN

NO LEAD

500 µm

DUAL

2 mm

3 mm

800 µm

MAXIM INTEGRATED PRODUCTS INC

DFN

HVSON, SOLCC8,.11,20

compliant

EAR99

8542.39.00.01

MAX17043G+T10W

Maxim Integrated Products

Check for Price

Yes

Transferred

POWER SUPPLY MANAGEMENT CIRCUIT

260

MATTE TIN

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

MAX17043X+

Maxim Integrated Products

Check for Price

Yes

Transferred

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,16

compliant

EAR99

8542.39.00.01

MAX17043G+TG075

Analog Devices Inc

Check for Price

Obsolete

POWER SUPPLY MANAGEMENT CIRCUIT

ANALOG DEVICES INC

unknown

MAX17043X+U

Maxim Integrated Products

Check for Price

Yes

Obsolete

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

S-PBGA-B9

Not Qualified

70 °C

-20 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.6 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

ROHS COMPLIANT, UCSP-9

compliant

EAR99

8542.39.00.01

MAX17043X+W

Maxim Integrated Products

Check for Price

Yes

Obsolete

POWER SUPPLY MANAGEMENT CIRCUIT

260

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

MAX17043X+T10

Analog Devices Inc

Check for Price

Yes

Active

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

9-WLCSP-N/A

2010-05-24

Analog Devices

MAX17043X+

Analog Devices Inc

Check for Price

Yes

Active

3.6 V

2.5 V

4.5 V

YES

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

R-PBGA-B9

Not Qualified

70 °C

-20 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.415 mm

1.595 mm

690 µm

9-WLCSP-N/A

2010-05-24

MAX17043G-E+U

Maxim Integrated Products

Check for Price

Yes

Obsolete

POWER SUPPLY MANAGEMENT CIRCUIT

260

MATTE TIN

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

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