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Parametric » Power Circuits » Power Management Circuits

Parametric results for: max20335bewx+ under Power Management Circuits

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Select Parts		Part Number

		MAX20335BEWX+ Analog Devices Inc
		MAX20335BEWX+T Maxim Integrated Products
		MAX20335BEWX+T Analog Devices Inc
		MAX20335BEWX+ Maxim Integrated Products

			Most Relevant							Technical			Compliance		Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Threshold Voltage-Nom	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Technology	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Part Package Code	Pin Count	Manufacturer Package Code	Date Of Intro	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Package Description

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

+3.1V

5

YES

NO

BATTERY MONITOR/RESET IC

1

BICMOS

R-XBGA-B36

1

85 °C

-40 °C

260

30

36

UNSPECIFIED

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

36-WLCSP-N/A

36

36-WLCSP-N/A

2018-09-19

Check for Price

Yes

Transferred

POWER SUPPLY SUPPORT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

+3.1V

5

YES

NO

BATTERY MONITOR/RESET IC

1

BICMOS

R-XBGA-B36

1

85 °C

-40 °C

260

30

36

UNSPECIFIED

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

36-WLCSP-N/A

36

36-WLCSP-N/A

2018-09-19

ANALOG DEVICES INC

compliant

Analog Devices

Check for Price

Yes

Transferred

POWER SUPPLY SUPPORT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

,

Compare

Analog Devices Inc

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

+3.1V

5

YES

NO

BATTERY MONITOR/RESET IC

1

BICMOS

R-XBGA-B36

1

85 °C

-40 °C

260

30

36

UNSPECIFIED

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

36-WLCSP-N/A

36

36-WLCSP-N/A

2018-09-19

Maxim Integrated Products

Check for Price

Yes

Transferred

POWER SUPPLY SUPPORT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

Analog Devices Inc

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

+3.1V

5

YES

NO

BATTERY MONITOR/RESET IC

1

BICMOS

R-XBGA-B36

1

85 °C

-40 °C

260

30

36

UNSPECIFIED

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

36-WLCSP-N/A

36

36-WLCSP-N/A

2018-09-19

ANALOG DEVICES INC

compliant

Analog Devices

Maxim Integrated Products

Check for Price

Yes

Transferred

POWER SUPPLY SUPPORT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

,